CMOS工艺中嵌入式ESD保护器件的2.4 ghz收发开关设计

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Chun-Yu Lin , Rui-Hong Liu , Ming-Dou Ker
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引用次数: 0

摘要

随着CMOS工艺的发展,射频(RF)集成电路的集成度不断提高。为了保护全集成射频收发器免受静电放电(ESD)的损坏,收发器前端的收发开关应精心设计,以绕过ESD电流。本文提出了一种嵌入式ESD保护器件技术,以提高收发开关的ESD性能。在T/R开关中,二极管和可控硅(SCR)的嵌入式ESD保护器件在晶体管之间产生,而不需要额外的ESD保护器件。可以简化不带ESD保护装置的射频电路的设计过程。在纳米级CMOS工艺中集成并实现了带有收发开关、PA和LNA的2.4 ghz收发器前端测试电路,测试了它们在RF工作和ESD应力下的性能。测试结果证实,嵌入式ESD保护器件能够提供足够的ESD保护能力,且不会降低电路性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of 2.4-GHz T/R switch with embedded ESD protection devices in CMOS process

As CMOS processes advanced, the integration of radio-frequency (RF) integrated circuits was increasing. In order to protect the fully-integrated RF transceiver from electrostatic discharge (ESD) damage, the transmit/receive (T/R) switch of transceiver frond-end should be carefully designed to bypass the ESD current. This work presented a technique of embedded ESD protection device to enhance the ESD capability of T/R switch. The embedded ESD protection devices of diodes and silicon-controlled rectifier (SCR) are generated between the transistors in T/R switch without using additional ESD protection device. The design procedure of RF circuits without ESD protection device can be simplified. The test circuits of 2.4-GHz transceiver frond-end with T/R switch, PA, and LNA have been integrated and implemented in nanoscale CMOS process to test their performances during RF operations and ESD stresses. The test results confirm that the embedded ESD protection devices can provide sufficient ESD protection capability and it is free from degrading circuit performances.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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