Microelectronics Reliability

SCI期刊
Microelectronics Reliability
中文名称:
微电子可靠性
期刊缩写:
Microelectron. Reliab.
影响因子:
1.6
ISSN:
print: 0026-2714
研究领域:
工程技术-工程:电子与电气
创刊年份:
1964年
h-index:
80
自引率:
12.50%
Gold OA文章占比:
14.36%
原创研究文献占比:
98.78%
SCI收录类型:
Science Citation Index Expanded (SCIE) || Scopus (CiteScore)
期刊介绍英文:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
CiteScore:
CiteScoreSJRSNIPCiteScore排名
3.30.3940.801
学科
排名
百分位
大类:Engineering
小类:Safety, Risk, Reliability and Quality
83 / 207
60%
大类:Engineering
小类:Electrical and Electronic Engineering
395 / 797
50%
大类:Physics and Astronomy
小类:Atomic and Molecular Physics, and Optics
118 / 224
47%
大类:Physics and Astronomy
小类:Condensed Matter Physics
230 / 434
47%
大类:Materials Science
小类:Surfaces, Coatings and Films
74 / 132
44%
大类:Materials Science
小类:Electronic, Optical and Magnetic Materials
161 / 284
43%
发文信息
中科院SCI期刊分区
大类 小类 TOP期刊 综述期刊
4区 工程技术
4区 工程:电子与电气 ENGINEERING, ELECTRICAL & ELECTRONIC
4区 纳米科技 NANOSCIENCE & NANOTECHNOLOGY
4区 物理:应用 PHYSICS, APPLIED
WOS期刊分区
学科分类
Q3ENGINEERING, ELECTRICAL & ELECTRONIC
Q4NANOSCIENCE & NANOTECHNOLOGY
Q3PHYSICS, APPLIED
历年影响因子
2015年1.2020
2016年1.3710
2017年1.2360
2018年1.4830
2019年1.5350
2020年1.5890
2021年1.4180
2022年1.6000
2023年1.6000
历年发表
2012年483
2013年334
2014年440
2015年437
2016年716
2017年470
2018年551
2019年337
2020年370
2021年358
2022年342
投稿信息
出版周期:
Monthly
出版语言:
English
出版国家(地区):
ENGLAND
接受率:
100%
审稿时长:
68 days
出版商:
Elsevier Ltd
编辑部地址:
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB

Microelectronics Reliability - 最新文献

Comparative study of single event upset susceptibility in the Complementary FET (CFET) and FinFET based 6T-SRAM

Pub Date : 2024-11-25 DOI: 10.1016/j.microrel.2024.115552 Zhengxin Zhang, Wangyong Chen, Jianwen Lin, Linlin Cai

Effects of humidity, ionic contaminations and temperature on the degradation of silicone-based sealing materials used in microelectronics

Pub Date : 2024-11-25 DOI: 10.1016/j.microrel.2024.115554 M. Yazdan Mehr , P. Hajipour , M.R. Karampoor , H. van Zeijl , W.D. van Driel , T. Cooremans , F. De Buyl , G.Q. Zhang

Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver

Pub Date : 2024-11-21 DOI: 10.1016/j.microrel.2024.115550 Freerik Forndran , Jens Heilmann , Markus Leicht , Bernhard Wunderle
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