纳米热界面材料与碳纳米管纳米颗粒的散热应用

Li Xu, Cong Yue, J. Liu, Yan Zhang, Xiuzhen Lu, Z. Cheng
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引用次数: 2

摘要

电子封装的散热问题已成为电子封装小型化的制约因素之一。消除产生的热量是电子封装中的一个关键问题。随着热管理技术的发展,热界面材料在电子封装中发挥着越来越重要的作用。近年来,人们提出了一种用静电纺丝法制备纳米纤维的新型纳米tim。在本实验研究中,在静电纺丝前将碳纳米管(CNT)纳米颗粒加入到聚合物溶液中,以提高纳米tim的导热性。采用聚氨酯聚合物溶液进行静电纺丝。研究了静电纺丝过程中若干工艺参数的影响。研究了针尖与集电极之间的距离、施加的电压和碳纳米管颗粒含量等不同的变量。利用扫描电子显微镜(SEM)对碳纳米管纳米颗粒的纳米tims进行了表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nano-thermal interface material with CNT nano-particles for heat dissipation application
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The scanning electron microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
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