用于毫米波无线芯片间/芯片内通信的三轴极化环形天线

Hae-in Kim, Renuka Bowrothu, Y. Yoon
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引用次数: 1

摘要

我们提出了一种三轴极化双环天线,用于3D系统级封装(SiP)中的片内/片内/板间无线通信。所提出的天线的优点如下:1)环形天线能够在77 GHz下沿x、y和z轴的所有三个方向上实现片间/片内/板间通信;2)并且,两个回路可以设计成产生任意的主辐射袍,而不相互正交,这有利于在理想的通信方向上提高天线效率;3)由于两个垂直通孔是设计的一部分,因此环路天线可以很容易地与任何穿过基板的通孔结构集成在1.1 mm2的紧凑足迹中。对辐射方向图进行了分析研究,并与高频结构模拟器(HFSS, ANSYS Inc.)的模拟结果进行了比较。模拟效率为94%,天线峰值增益为3.14 dBi。利用微加工和铣床在254 μm厚的RT duroid 5880衬底上制作了原型。采用带散射参数的矢量网络分析仪对天线性能进行了表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Tri-axis Polarized Loop Antenna for mmWave Wireless Inter/intra Chip Communications
We present a tri-axis polarized dual loop antenna for inter/intra chip/board wireless communications in a 3D system-in-package (SiP). The advantages of the presented antenna are as follows: 1) the loop antenna enables inter/intra chip/board communications in all three directions along x, y, and z-axis at 77 GHz; 2) also, the two loops can be designed to produce rather arbitrary main radiation robes without being orthogonal each other, which facilitates improved antenna efficiency in desirable communication directions; 3) since two vertical via holes are the part of the design, this loop antenna can be easily integrated with any through-substrate via structures in a compact footprint of 1.1 mm2. Analytical study for the radiation patterns is carried out and the resultant radiation patterns are compared to simulated ones with High Frequency Structure Simulator (HFSS, ANSYS Inc.). The simulated efficiency and antenna peak gain are 94 % and 3.14 dBi, respectively. A prototype is fabricated on a 254 μm thick RT duroid 5880 substrate using microfabrication and milling machines. Antenna performance is characterized using vector network analyzer with scattering parameters.
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