2022年半导体制造国际研讨会特邀编辑特辑

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2023-10-30 DOI:10.1109/TSM.2023.3323254

Tsuyoshi Moriya

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引用次数: 0

摘要

自1992年在日本成立以来，国际半导体制造研讨会（ISSM）为专业人士提供了分享半导体制造技术最佳实践的独特机会。在研讨会上，半导体制造专业人士讨论了为满足全球先进制造要求而开发的技术。从提高半导体器件性能的基本原理角度重新审视半导体制造变得至关重要。此外，利用人工智能和机器学习技术来改善半导体制造已成为一项新的挑战。这些制造技术挑战表明，需要激烈的革命性概念和更强有力的合作努力，以找到应对竞争前挑战的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Guest Editorial Special section on the 2022 International Symposium on Semiconductor Manufacturing

Since its beginning in 1992 in Japan, International Symposium on Semiconductor Manufacturing (ISSM) has provided unique opportunities to share the best practices of semiconductor manufacturing technologies for professionals. At the symposiums, semiconductor manufacturing professionals discussed the technologies developed to meet the worldwide requirements for advanced manufacturing. It is becoming crucial to re-examine semiconductor manufacturing in terms of fundamental principles to improve the performance of semiconductor devices. Moreover, utilizing artificial intelligence and machine learning technologies to improve semiconductor manufacturing have become a new challenge. These manufacturing technology challenges are showing the need for drastic revolutionary concept and stronger collaborative efforts to find solutions to the precompetitive challenges.

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.