基于自编码器的图卷积网络快速光学接近校正

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Gangmin Cho;Taeyoung Kim;Youngsoo Shin
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引用次数: 0

摘要

OPC是一个非常耗时的掩模合成过程。提出了基于布局编码器和掩码解码器的GCN快速准确的OPC算法。(1) GCN采用MLP进行一系列的聚合进行校正过程。将特定多边形的特征与相邻多边形的加权特征进行聚合;这是使用GCN的一个关键动机,因为一个多边形应该被纠正,而它的邻居被考虑到更准确的纠正。(2) GCN输入由布局编码器提供,该编码器从每个布局多边形中提取一个特征。GCN输出,对应于校正多边形的特征,由掩码解码器处理以产生最终的掩码模式。(3)编码器和解码器来自各自的自动编码器。解码器的高保真度是保证OPC质量的关键。这是通过在编码器和解码器连接时对具有单个损失函数的两个自编码器进行集体训练来实现的。实验表明,使用简单的MLP模型,该OPC的EPE比OPC小47%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fast Optical Proximity Correction Using Graph Convolutional Network With Autoencoders
OPC is a very time consuming process for mask synthesis. Quick and accurate OPC using GCN with layout encoder and mask decoder is proposed. (1) GCN performs a series of aggregation with MLP for correction process. A feature of a particular polygon is aggregated with weighted features of neighbor polygons; this is a key motivation of using GCN since one polygon should be corrected while its neighbors are taken into account for more accurate correction. (2) GCN inputs are provided by a layout encoder, which extracts a feature from each layout polygon. GCN outputs, features corresponding to corrected polygons, are processed by a mask decoder to yield the final mask pattern. (3) The encoder and decoder originate from respective autoencoders. High fidelity of decoder is a key for OPC quality. This is achieved by collective training of the two autoencoders with a single loss function while the encoder and decoder are connected. Experiments demonstrate that the proposed OPC achieves 47% smaller EPE than OPC using a simple MLP model.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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