迈向更智能的硅和数据驱动的集成电路设计[来自EIC]

K. Chakrabarty
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引用次数: 0

摘要

本期IEEE计算机设计与测试(D&T)聚焦于智能硅的主题,以实现可预测的性能和高可靠性,而无需显着的保护带。特邀编辑Mohammad Tehranipoor和LeRoy Winemberg主动并勤奋地将这期特刊与五篇精选文章组合在一起,其中包括来自学术界和工业界的专家的贡献。这些文章涵盖了智能硅的许多方面,包括用于监测老化的片上结构,主动预防错误的电压和频率缩放,性能下降与操作条件之间关系的研究,SerDes的优化以及硬件木马检测。本期《D&T》还包括年度国际测试会议(ITC)专题。候选论文从ITC 2011中选出,并通过常规的D&T审查程序。经评审,三篇论文入选ITC专题。ITC 2011年的第四篇论文将作为“获奖论文”发表。这篇题为“集成电路系统缺陷的物理感知分析”的论文是基于2011年获得E. J. McCluskey 2012年最佳博士论文奖的Chiu-Wing (Jason) Tam的博士论文。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards smarter silicon and data-driven design of integrated circuits [From the EIC]
This issue of IEEE Design & Test of Computers (D&T) is focused on the theme of smarter silicon for achieving predictable performance and high reliability without the need for significant guard banding. Guest Editors Mohammad Tehranipoor and LeRoy Winemberg have taken the initiative and worked diligently to put together this special issue with a set of five selected articles, which include contributions by experts from both academia and industry. These articles cover a number of aspects of smarter silicon, including onchip structures for monitoring aging, voltage and frequency scaling to proactively prevent errors, a study of the relationship between performance degradation and operating conditions, optimization of SerDes, and hardware Trojan detection. This issue of D&T also includes the annual International Test Conference (ITC) special section. Candidate papers were selected from ITC 2011 and they went through the regular D&T review process. After review, three papers were selected for inclusion in the ITC special section. A fourth paper from ITC 2011 is being published as a "prize paper." The paper titled "Physically-Aware Analysis of Systematic Defects in Integrated Circuits" is based on the PhD thesis of Chiu-Wing (Jason) Tam, who won the E. J. McCluskey Best 2012 Doctoral Thesis Award in 2011.
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来源期刊
IEEE Design & Test of Computers
IEEE Design & Test of Computers 工程技术-工程:电子与电气
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