硅的调试和诊断[来自EIC]

A. Ivanov
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引用次数: 0

摘要

主编很高兴为您呈现这一期7 - 8月刊,它为您带来了一系列文章,涵盖了丰富的学术和工业工作,解决了在不同抽象层次上表示的不同基于ic的系统的设计、验证和测试的最新问题。根据具体情况,不同方法的优点有所不同,但通常是成本、性能、质量、产量和可行性的变化。介绍了每篇技术文章和特性的概述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A look at silicon debug and diagnosis [From the EIC]
The Editor-in-Cheif is pleased to present this July-August issue, which brings you a combination of articles that cover a rich set of academic and industrial work addressing state-of-the-art issues of design, verification, and test of different IC-based systems represented at different levels of abstraction. The figure of merit for the different approaches varies, depending on the specific case, but are generally variations of cost, performance, quality, yield, and feasibility. An overview of each of the technical articles and features is presented.
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来源期刊
IEEE Design & Test of Computers
IEEE Design & Test of Computers 工程技术-工程:电子与电气
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