“界面顺应性对多层微电子封装中热机械应力的影响”一文述评

H. Yin
{"title":"“界面顺应性对多层微电子封装中热机械应力的影响”一文述评","authors":"H. Yin","doi":"10.1109/TADVP.2009.2033571","DOIUrl":null,"url":null,"abstract":"An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir's result. However, a minor inconsistence in Suhir's derivation is still found. The applicability and modification of Suhir's model are discussed.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"353-355"},"PeriodicalIF":0.0000,"publicationDate":"2010-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2009.2033571","citationCount":"4","resultStr":"{\"title\":\"Comments on \\\"Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging\",\"authors\":\"H. Yin\",\"doi\":\"10.1109/TADVP.2009.2033571\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir's result. However, a minor inconsistence in Suhir's derivation is still found. The applicability and modification of Suhir's model are discussed.\",\"PeriodicalId\":55015,\"journal\":{\"name\":\"IEEE Transactions on Advanced Packaging\",\"volume\":\"33 1\",\"pages\":\"353-355\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TADVP.2009.2033571\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Advanced Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TADVP.2009.2033571\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Advanced Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TADVP.2009.2033571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

Suhir早在1986年就提出了一种计算狭长带的界面柔顺性的方法,这是一种通用的显式方法,但Basaran和Wen声称推导过程中存在错误。使用额外的近似,他们获得了一种不同形式的纵向界面顺应性。然而,这种近似是不合适的。不考虑它,我们可以看到他们的结果和Suhir的结果是一样的。然而,在Suhir的推导中仍然发现了一个小的矛盾。讨论了Suhir模型的适用性和修正问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir's result. However, a minor inconsistence in Suhir's derivation is still found. The applicability and modification of Suhir's model are discussed.
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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