光辅助导电原子力显微镜研究Ag-ZnO薄膜的电子输运性能

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Yidong Zhang
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引用次数: 0

摘要

目的研究Ag-ZnO薄膜在暗光和紫外光条件下的电子输运性能。采用溶胶-凝胶法在氟薄氧化物(FTO)衬底上制备了掺杂ag的ZnO薄膜。采用Cu Kα辐射x射线衍射测试了ZnO和Ag-ZnO粉末的晶体结构。用紫外可见分光光度计记录了ZnO和Ag-ZnO薄膜的吸收光谱。利用光辅助导电原子力显微镜(PC-AFM)研究了Ag-ZnO薄膜在暗态和亮态下的微电输运性能。结果表明,Ag-ZnO薄膜在黑暗中反向电流没有增加,但在光照下反向电流明显增加,说明Ag-ZnO薄膜对光的响应能力大大提高,这是由于欧姆接触的形成。据作者所知,本文首次利用PC-AFM研究了Ag-ZnO薄膜在暗、光状态下的微电输运性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy
Purpose The purpose of this paper is to study the electronic transport performance of Ag-ZnO film under dark and UV light conditions. Design/methodology/approach Ag-doped ZnO thin films were prepared on fluorine thin oxide (FTO) substrates by sol-gel method. The crystal structure of ZnO and Ag-ZnO powders was tested by X-ray diffraction with Cu Kα radiation. The absorption spectra of ZnO and Ag-ZnO films were recorded by a UV–visible spectrophotometer. The micro electrical transport performance of Ag-ZnO thin films in dark and light state was investigated by photoassisted conductive atomic force microscope (PC-AFM). Findings The results show that the dark reverse current of Ag-ZnO films does not increase, but the reverse current increases significantly under illumination, indicating that the response of Ag-ZnO films to light is greatly improved, owing to the formation of Ohmic contact. Originality/value To the best of the author’s knowledge, the micro electrical transport performance of Ag-ZnO thin films in dark and light state was firstly investigated by PC-AFM.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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