金属辅助化学刻蚀N型和P型硅纳米结构的比较

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hanna Ohlin , Thomas Frisk , Ilya Sychugov , Ulrich Vogt
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引用次数: 0

摘要

金属辅助化学蚀刻是在硅中制备高纵横比微米和纳米结构的一种很有前途的方法。先前的结果表明,P型和N型硅蚀刻具有不同程度的各向异性,这对P型硅用于纳米结构提出了质疑。在这项研究中,我们比较了用金催化剂通过金属辅助化学蚀刻在N型和P型硅中处理X射线带板纳米结构。对预制区板进行劈裂和研究,重点关注由此产生的垂直度、深度和孔隙率。结果表明,对于高纵横比纳米结构,N型和P型硅都被证明是可行的替代品,表现出不同的蚀刻速率,但在孔隙率和蚀刻方向方面有相似之处。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Comparing metal assisted chemical etching of N and P-type silicon nanostructures

Comparing metal assisted chemical etching of N and P-type silicon nanostructures

Metal assisted chemical etching is a promising method for fabricating high aspect ratio micro- and nanostructures in silicon. Previous results have suggested that P-type and N-type silicon etches with different degrees of anisotropy, questioning the use of P-type silicon for nanostructures. In this study, we compare processing X-ray zone plate nanostructures in N and P-type silicon through metal assisted chemical etching with a gold catalyst. Fabricated zone plates were cleaved and studied with a focus on resulting verticality, depth and porosity. Results show that for high aspect ratio nanostructures, both N and P-type silicon prove to be viable alternatives exhibiting different etch rates, but similarities regarding porosity and etch direction.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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