SoC环境中加密核心的设计、集成和实现

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
J. Pandey, Sanskriti Gupta, A. Karmakar
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引用次数: 0

摘要

目的本文旨在开发一种系统的方法,在片上系统SoC环境中设计、集成和实现一组加密核心,用于数据安全应用。高级加密标准(AES)和PRESENT块密码被部署在一起,从而产生了用于执行加密和解密操作的通用加密芯片。设计/方法论/方法提出了一种适用于AES和PRESENT密码的超大规模集成电路(VLSI)体系结构及其实现。根据选择,该体系结构对所选密码执行加密或解密操作。提供了现场可编程门阵列(FPGA)和专用集成电路(ASIC)实现的实验结果以及相关的设计分析。发现该体系结构在Xilinx xc5vfx70t-1-ff1136器件上的FPGA实现消耗了19%的片,而ASIC设计在180中实现 nm互补金属氧化物半导体ASIC技术,占用1.0746 mm2的标准单元面积,在50 MHz时钟频率。还提供了一种在开源SoC环境上使用所设计的架构的安全音频应用程序。讨论了使用基于FPGA的平台和工具验证所设计芯片的测试方法。独创性/价值将所提出的体系结构与一组现有硬件体系结构进行比较,以分析各种设计指标,如延迟、面积、最大工作频率、功率和吞吐量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design, integration and implementation of crypto cores in an SoC environment
Purpose The paper aims to develop a systematic approach to design, integrate, and implement a set of crypto cores in a system-on-chip SoC) environment for data security applications. The advanced encryption standard (AES) and PRESENT block ciphers are deployed together, leading to a common crypto chip for performing encryption and decryption operations. Design/methodology/approach An integrated very large-scale integration (VLSI) architecture and its implementation for the AES and PRESENT ciphers is proposed. As per the choice, the architecture performs encryption or decryption operations for the selected cipher. Experimental results of the field-programmable gate array (FPGA) and application-specific integrated circuit (ASIC) implementations and related design analysis are provided. Findings FPGA implementation of the architecture on Xilinx xc5vfx70t-1-ff1136 device consumes 19% slices, whereas the ASIC design is implemented in 180 nm complementary metal-oxide semiconductor ASIC technology that takes 1.0746 mm2 of standard cell area and consumes 14.26 mW of power at 50 MHz clock frequency. A secure audio application using the designed architecture on an open source SoC environment is also provided. A test methodology for validation of the designed chip using an FPGA-based platform and tools is discussed. Originality/value The proposed architecture is compared with a set of existing hardware architectures for analyzing various design metrics such as latency, area, maximum operating frequency, power, and throughput.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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