高生长温度下InGaN量子阱V/III比对近紫外发光二极管的影响

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
M. Sahar, Z. Hassan, S. Ng, W. F. Lim, K. S. Lau, E. A. Alias, M. A. Ahmad, N. Hamzah, R. Asri
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引用次数: 2

摘要

本文的目的是研究氮化铟镓(InGaN)量子阱(QW)的V/III比对结构,近紫外发光二极管(NUV-LED)的光学和电学性能。设计/方法/方法利用金属有机化学气相沉积在常压下在c平面图案化蓝宝石衬底上成功生长了InGaN基NUV-LED。根据高分辨率X射线衍射,随着V/III比从20871增加到11824,InGaN量子阱的铟组成和厚度增加。还发现V/III比率对InGaN QW的表面形态以及由此对后续层的表面形态具有重要影响。此外,电致发光测量显示,V/III比对NUV-LED的光输出功率(LOP)和发射峰值波长有主要影响。LOP在100时增加了53% mA,并且随着V/III比从20871降低到11824,NUV-LED的发射峰值波长变为更长的波长。本研究发现了V/III比与QW的性质之间的关系,这导致了NUV-LED LOP的增强。产生低V/III比的高TMIn流速有助于NUV-LED的LOP增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes
Purpose The aims of this paper is to study the effects of the V/III ratio of indium gallium nitride (InGaN) quantum wells (QWs) on the structural, optical and electrical properties of near-ultraviolet light-emitting diode (NUV-LED). Design/methodology/approach InGaN-based NUV-LED is successfully grown on the c-plane patterned sapphire substrate at atmospheric pressure using metal organic chemical vapor deposition. Findings The indium composition and thickness of InGaN QWs increased as the V/III ratio increased from 20871 to 11824, according to high-resolution X-ray diffraction. The V/III ratio was also found to have an important effect on the surface morphology of the InGaN QWs and thus the surface morphology of the subsequent layers. Apart from that, the electroluminescence measurement revealed that the V/III ratio had a major impact on the light output power (LOP) and the emission peak wavelength of the NUV-LED. The LOP increased by up to 53% at 100 mA, and the emission peak wavelength of the NUV-LED changed to a longer wavelength as the V/III ratio decreased from 20871 to 11824. Originality/value This study discovered a relation between the V/III ratio and the properties of QWs, which resulted in the LOP enhancement of the NUV-LED. High TMIn flow rates, which produced a low V/III ratio, contribute to the increased LOP of NUV-LED.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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