全匹配双级CMOS功率放大器,集成无源线性化器,增益23 db, PAE 40%, OIP3 28 DBM

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Premmilaah Gunasegaran, J. Rajendran, S. Mariappan, Y. Yusof, Z. Aziz, Narendra Kumar
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引用次数: 2

摘要

目的本文的目的是介绍一种新的线性化技术,即无源线性化技术。该技术在保持20以上的功率增益的同时,不影响功率增加效率(PAE) 用于互补金属氧化物半导体(CMOS)功率放大器(PA)的dB。设计/方法/方法借助于主放大器栅极的无源线性化电路来执行线性化机制,以通过在主放大器处产生相反的相位响应来最小化Cgs电容的影响。无电感输出匹配网络提供了一种几乎无损的输出匹配网络,有助于实现高增益、PAE和输出功率。线性性能得到改善,而不会受到功耗、功率增益和稳定性的影响。Findings通过这种拓扑结构,PA提供了20多个 蓝牙低能量(BLE)频段从2.4开始的dB增益 GHz至2.5 GHz,电源余量为1.8 五、中心频率2.45 GHz,PA的增益为23.3 dB,在14.3的最大输出功率下对应的峰值PAE为40.11% dBm。在12.7的最大线性输出功率下 dBm,PAE达到37.3%,峰值三阶互调产物为28.04 dBm,功耗为50.58 mW。这对应于–20的ACLR dBc,从而使PA有资格进行BLE操作。实际意义所提出的技术能够提高效率和输出功率,并将PA线性化为接近1 dB压缩点。这减少了CMOS PA设计中线性输出功率和PAE之间的折衷。独创性/价值所提出的CMOS PA可以舒适地集成到BLE发射器上,从而降低收发器的整体功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP3
Purpose The purpose of this paper is to introduce a new linearization technique known as the passive linearizer technique which does not affect the power added efficiency (PAE) while maintaining a power gain of more than 20 dB for complementary metal oxide semiconductor (CMOS) power amplifier (PA). Design/methodology/approach The linearization mechanism is executed with an aid of a passive linearizer implemented at the gate of the main amplifier to minimize the effect of Cgs capacitance through the generation of opposite phase response at the main amplifier. The inductor-less output matching network presents an almost lossless output matching network which contributes to high gain, PAE and output power. The linearity performance is improved without the penalty of power consumption, power gain and stability. Findings With this topology, the PA delivers more than 20 dB gain for the Bluetooth Low Energy (BLE) Band from 2.4 GHz to 2.5 GHz with a supply headroom of 1.8 V. At the center frequency of 2.45 GHz, the PA exhibits a gain of 23.3 dB with corresponding peak PAE of 40.11% at a maximum output power of 14.3 dBm. At a maximum linear output power of 12.7 dBm, a PAE of 37.3% has been achieved with a peak third order intermodulation product of 28.04 dBm with a power consumption of 50.58 mW. This corresponds to ACLR of – 20 dBc, thus qualifying the PA to operate for BLE operation. Practical implications The proposed technique is able to boost up the efficiency and output power, as well as linearize the PA closer to 1 dB compression point. This reduces the trade-off between linear output power and PAE in CMOS PA design. Originality/value The proposed CMOS PA can be integrated comfortably to a BLE transmitter, allowing it to reduce the transceiver’s overall power consumption.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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