老化温度对电子系统焊点热机械疲劳寿命的影响

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2021-03-01 DOI:10.1108/SSMT-07-2020-0029

W. Siswanto, K. Borodin, Z. Mahmoud, A. Surendar, S. Sajjadifar, G. Abdilova, Jun Chang

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引用次数: 4

摘要

目的研究老化温度对电子器件筒形焊点寿命的影响，并将这些影响纳入修正的预测模型。设计/方法/方法在不同应力幅值和时效温度下进行了多次加速剪切应力试验。结果发现，随着时效温度的升高，寿命降低。在考虑老化温度的情况下，莫罗能量模型是最佳的预测模型。原创性价值确认。

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Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.