电子组件中小时玻璃型焊点的精确成分相关热机械寿命估计

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2021-07-22 DOI:10.1108/SSMT-12-2020-0055

Leonid Anatolevich Olenev, R. Zakieva, N. Smirnova, R. Shichiyakh, K. Ershov, Nisith Geetha

{"title":"电子组件中小时玻璃型焊点的精确成分相关热机械寿命估计","authors":"Leonid Anatolevich Olenev, R. Zakieva, N. Smirnova, R. Shichiyakh, K. Ershov, Nisith Geetha","doi":"10.1108/SSMT-12-2020-0055","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis study aims to present a more accurate lifetime prediction model considering solder chemical composition.\n\n\nDesign/methodology/approach\nThermal cycling and standard creep tests as well as finite element simulation were used.\n\n\nFindings\nThe study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.\n\n\nOriginality/value\nIt is confirmed.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2021-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies\",\"authors\":\"Leonid Anatolevich Olenev, R. Zakieva, N. Smirnova, R. Shichiyakh, K. Ershov, Nisith Geetha\",\"doi\":\"10.1108/SSMT-12-2020-0055\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nThis study aims to present a more accurate lifetime prediction model considering solder chemical composition.\\n\\n\\nDesign/methodology/approach\\nThermal cycling and standard creep tests as well as finite element simulation were used.\\n\\n\\nFindings\\nThe study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.\\n\\n\\nOriginality/value\\nIt is confirmed.\\n\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2021-07-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/SSMT-12-2020-0055\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/SSMT-12-2020-0055","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 1

摘要

目的本研究旨在提出一个考虑焊料化学成分的更准确的寿命预测模型。设计/方法/方法采用热循环和标准蠕变试验以及有限元模拟。研究发现焊点寿命评估的误差较小。Ag含量越高，寿命就越高。独创性/价值已确认。

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Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.