一种基于神经网络的微波成像目标定位方法

IF 1.6 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Wonhyung Son, W. Park, Seong‐Ho Son
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引用次数: 0

摘要

本文提出了一种利用人工神经网络定位目标的微波成像新方法。经过训练的神经网络从测量的散射数据重建断层图像,例如非线性电磁逆散射求解器。通过网络预测和目标值之间的交叉熵来确定隐藏神经元的适当数量。为了通过实验验证这种方法,我们建立了一个由16个天线组成的试验台,这些天线在水下发射和接收950 MHz的微波,并使用直径为2毫米的金属棒作为定位目标。结果显示出优异的成像性能,具有较少的伪影和小于2mm的定位误差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Neural Network-Based Microwave Imaging Method for Object Localization
This paper presents a new microwave imaging method using artificial neural networks to localize an object. The trained neural network reconstructs a tomographic image from the measured scattering data, such as a nonlinear electromagnetic inverse scattering solver. The appropriate number of hidden neurons is determined through the cross-entropy between network predictions and target values. To verify this method experimentally, we set up a testbed consisting of 16 antennas that transmit and receive 950 MHz microwaves underwater and used a metal rod with a diameter of 2 mm as a localizing target. The results show excellent imaging performance with fewer artifacts and less than a 2-mm localization error.
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来源期刊
Journal of electromagnetic engineering and science
Journal of electromagnetic engineering and science ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
2.90
自引率
17.40%
发文量
82
审稿时长
10 weeks
期刊介绍: The Journal of Electromagnetic Engineering and Science (JEES) is an official English-language journal of the Korean Institute of Electromagnetic and Science (KIEES). This journal was launched in 2001 and has been published quarterly since 2003. It is currently registered with the National Research Foundation of Korea and also indexed in Scopus, CrossRef and EBSCO, DOI/Crossref, Google Scholar and Web of Science Core Collection as Emerging Sources Citation Index(ESCI) Journal. The objective of JEES is to publish academic as well as industrial research results and discoveries in electromagnetic engineering and science. The particular scope of the journal includes electromagnetic field theory and its applications: High frequency components, circuits, and systems, Antennas, smart phones, and radars, Electromagnetic wave environments, Relevant industrial developments.
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