随机振动频率下焊点疲劳寿命的器件结构优化

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2020-10-15 DOI:10.1108/ssmt-05-2020-0020

Yang Gao, Fuwei Wang, Ding Shaohu, Bin Yang, Lin Liu, M. Salmani

引用次数: 1

摘要

目的研究振动对球栅阵列寿命的影响。设计/方法/方法进行了几次有限元模拟和实验。查找找到了优化的电路配置。独创性/价值论文的独创性得到了作者的证实。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Purpose This study aims to investigate the vibration effects on ball grid array lifetime. Design/methodology/approach Several finite element method simulations and experiments were performed. Findings An optimized circuit configuration was found. Originality/value The originality of paper is confirmed by authors.

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.