p-GaN层中三步镁掺杂对ingan基发光二极管性能的影响

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
N. Hamzah, M. A. Ahmad, R. Asri, E. A. Alias, M. Sahar, N. S. Shiong, Z. Hassan
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引用次数: 1

摘要

目的本文的目的是通过引入三步镁掺杂来提高LED的效率。注意第一p-GaN层(即靠近有源区的层)的Mg掺杂浓度的影响。注意第一p-GaN层(即靠近有源区的层)的Mg掺杂浓度的影响。设计/方法/方法使用金属有机化学气相沉积在4英寸c平面图案化蓝宝石衬底上生长基于氮化铟镓(InGaN)的发光二极管(LED)。第二和第三p-GaN层的Cp2Mg流速设定为50 sccm和325 sccm。对于第一p-GaN层,Cp2Mg的流速从150变化 sccm至300 sccm以实现不同的Mg掺杂剂浓度。发现GaN(102)平面的半峰全宽(FWHM)随着Cp2Mg流量的增加而增加。具有150、250和300的样品的FWHM sccm Cp2Mg流速为233 arcsec,236 arcsec和245 arcsec。这一结果表明,p-GaN层中的边缘位错和混合位错随着Cp2Mg流量的增加而增加。原子力显微镜(AFM)结果显示,用300 sccm的表面粗糙度最高,其次是150 sccm和250 sccm。这些样品的表面粗糙度为2.40 纳米,2.12 nm和2.08 nm。同时,250 与其他样品相比,sccm样品在黄色带比率上显示出最高的带边缘强度。光输出功率测量发现 sccm由于向有源区注入足够的空穴而表现出高输出功率。独创性/价值通过本研究,提出了p-GaN层上Mg轮廓的三个步骤,以显示高效的InGaN基LED。研究了第一p-GaN层(即靠近有源区的层)上的最佳Mg浓度,以通过改变Cp2Mg流速来提高LED性能。这一发现与当样品含有250 sccm具有最高的Mg受体和良好的p-GaN层的表面质量。可以推断,第一p-GaN层掺杂对LED外延结构的晶体质量、表面粗糙度和发光性能有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode
Purpose The purpose of this paper is to enhance the efficiency of the LED by introducing three-step magnesium (Mg) doping profile. Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Design/methodology/approach Indium gallium nitride (InGaN)–based light-emitting diode (LED) was grown on a 4-inch c-plane patterned sapphire substrate using metal organic chemical vapor deposition. The Cp2Mg flow rates for the second and third p-GaN layers were set at 50 sccm and 325 sccm, respectively. For the first p-GaN layer, the Cp2Mg flow rate varied from 150 sccm to 300 sccm to achieve different Mg dopant concentrations. Findings The full width at half maximum (FWHM) for the GaN (102) plane increases with increasing Cp2Mg flow rate. FWHM for the sample with 150, 250 and 300 sccm Cp2Mg flow rates was 233 arcsec, 236 arcsec and 245 arcsec, respectively. This result indicates that the edge and mixed dislocations in the p-GaN layer were increased with increasing Cp2Mg flow rate. Atomic force microscopy (AFM) results reveal that the sample grown with 300 sccm exhibits the highest surface roughness, followed by 150 sccm and 250 sccm. The surface roughness of these samples is 2.40 nm, 2.12 nm and 2.08 nm, respectively. Simultaneously, the photoluminescence (PL) spectrum of the 250 sccm sample shows the highest band edge intensity over the yellow band ratio compared to that of other samples. The light output power measurements found that the sample with 250 sccm exhibits high output power because of sufficient hole injection toward the active region. Originality/value Through this study, the three steps of the Mg profile on the p-GaN layer were proposed to show high-efficiency InGaN-based LED. The optimal Mg concentration was studied on the first p-GaN layer (i.e. layer close to active region) to improve the LED performance by varying the Cp2Mg flow rate. This finding was in line with the result of PL and AFM results when the samples with 250 sccm have the highest Mg acceptor and good surface quality of the p-GaN layer. It can be deduced that the first p-GaN layer doping has a significant effect on the crystalline quality, surface roughness and light emission properties of the LED epi structure.
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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