以PVDF-TrFE- rgo复合材料为电极的全3d打印PVDF-TrFE基压电器件

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Antrea Spanou , Cecilia Persson , Stefan Johansson
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引用次数: 0

摘要

直接墨水写入(DIW)是微系统技术领域中一种很有前途的增材制造(AM)技术,因为它具有高细节分辨率的潜力和适用于该技术的广泛材料选择。在本研究中,开发了聚偏二氟乙烯-三氟乙烯油墨(PVDF-TrFE)以及具有还原氧化石墨烯的复合油墨(PVDF-TrFE-rGO),并适用于连续流动DIW。复合PVDF-TrFE-rGO油墨在1.5wt%后实现了渗滤,并且在本研究中研究的最高负载(7wt%)下实现了2.8S/cm的电导率。油墨以最小喷嘴直径40μm成功印刷在包括玻璃、金属和丁腈弹性体在内的不同基材上。还证明了墨水可以用于创建具有预测响应的完全3D打印的压电器件,即制造技术没有恶化器件的功能。导电复合油墨被成功地用作器件中的有效电极。因此,已经证明,通过将诸如复合PVDF-TrFE-rGO油墨和共聚物PVDF-TrFE的材料与增材制造技术相结合,可以实现低成本、多功能器件的制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Fully 3D-printed PVDF-TrFE based piezoelectric devices with PVDF-TrFE-rGO composites as electrodes

Fully 3D-printed PVDF-TrFE based piezoelectric devices with PVDF-TrFE-rGO composites as electrodes

Direct ink writing (DIW) is a promising additive manufacturing (AM) technique in the field of microsystems technology due to the potential for high detail resolution and the wide choice of materials suitable for the technique. In this study, inks of polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE) as well as composite inks with reduced graphene oxide (PVDF-TrFE-rGO) were developed and adapted for continuous flow DIW. The composite PVDF-TrFE-rGO inks achieved percolation after 1.5 wt% and electrical conductivity of 2.8 S/cm at the highest loading investigate in this study (7 wt%). The inks were successfully printed with minimum nozzle diameter of 40 μm on different substrates including glass, metal and a nitrile elastomer. It was also demonstrated that the inks can be used to create a fully 3D-printed piezoelectric device with the predicted response, i.e. the fabrication technique did not deteriorate the functionality of the device. The conductive composite ink was successfully utilized as an effective electrode in the device. It was therefore demonstrated that by combining materials, such as the composite PVDF-TrFE-rGO ink and the co-polymer PVDF-TrFE with additive manufacturing techniques, the fabrication of low-cost, versatile devices can be achieved.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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