An-Na Cha , Gieop Lee , Hyunggu Kim , Chaewon Seong , Hyojung Bae , Hokyun Rho , Vishal Burungale , Young-Boo Moon , Jun-Seok Ha
{"title":"Ni-Pd-CNT纳米合金掩膜上生长无裂纹α-Ga2O3厚膜","authors":"An-Na Cha , Gieop Lee , Hyunggu Kim , Chaewon Seong , Hyojung Bae , Hokyun Rho , Vishal Burungale , Young-Boo Moon , Jun-Seok Ha","doi":"10.1016/j.mssp.2025.110144","DOIUrl":null,"url":null,"abstract":"<div><div>We report a Ni–Pd–CNT-based nanoalloy mask that improves the crystalline quality of α-Ga<sub>2</sub>O<sub>3</sub> epilayers grown via halide vapor phase epitaxy (HVPE). Conventional heteroepitaxy of α-Ga<sub>2</sub>O<sub>3</sub> on sapphire substrates typically results in high dislocation densities due to lattice and thermal expansion mismatches. To address this problem, a Ni–Pd–CNT nanoalloy layer was deposited on a (0001)-oriented α-Ga<sub>2</sub>O<sub>3</sub> buffer layer using electroless plating and spray coating, and α-Ga<sub>2</sub>O<sub>3</sub> was regrown for 15 min. Among the plating durations tested (20, 40, and 60 s), the 40 s condition yielded the thickest epilayer (∼11 μm), the lowest etch pit density (∼4.8 × 10<sup>7</sup> cm<sup>−2</sup>), and the narrowest X-ray diffraction rocking curve for the asymmetric (10–14) reflection.</div><div>AFM and SEM analyses confirmed improved surface uniformity and reduced tilting of seed crystals under these conditions. All samples exhibited high optical transmittance (>80 %) in the visible region and a direct bandgap of ∼5.13 eV, which indicates that the optical properties remained stable regardless of the Ni content. These results show that the Ni–Pd–CNT-assisted nano-epitaxial lateral overgrowth (nano-ELOG) approach effectively reduces threading dislocation density while preserving wide bandgap transparency. This method offers a low-cost, scalable route for producing high-quality α-Ga<sub>2</sub>O<sub>3</sub>, with strong potential for next-generation power electronics and UV optoelectronic devices.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"202 ","pages":"Article 110144"},"PeriodicalIF":4.6000,"publicationDate":"2025-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Crack-free thick α-Ga2O3 films grown on Ni–Pd-CNT nanoalloy masks\",\"authors\":\"An-Na Cha , Gieop Lee , Hyunggu Kim , Chaewon Seong , Hyojung Bae , Hokyun Rho , Vishal Burungale , Young-Boo Moon , Jun-Seok Ha\",\"doi\":\"10.1016/j.mssp.2025.110144\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>We report a Ni–Pd–CNT-based nanoalloy mask that improves the crystalline quality of α-Ga<sub>2</sub>O<sub>3</sub> epilayers grown via halide vapor phase epitaxy (HVPE). Conventional heteroepitaxy of α-Ga<sub>2</sub>O<sub>3</sub> on sapphire substrates typically results in high dislocation densities due to lattice and thermal expansion mismatches. To address this problem, a Ni–Pd–CNT nanoalloy layer was deposited on a (0001)-oriented α-Ga<sub>2</sub>O<sub>3</sub> buffer layer using electroless plating and spray coating, and α-Ga<sub>2</sub>O<sub>3</sub> was regrown for 15 min. Among the plating durations tested (20, 40, and 60 s), the 40 s condition yielded the thickest epilayer (∼11 μm), the lowest etch pit density (∼4.8 × 10<sup>7</sup> cm<sup>−2</sup>), and the narrowest X-ray diffraction rocking curve for the asymmetric (10–14) reflection.</div><div>AFM and SEM analyses confirmed improved surface uniformity and reduced tilting of seed crystals under these conditions. All samples exhibited high optical transmittance (>80 %) in the visible region and a direct bandgap of ∼5.13 eV, which indicates that the optical properties remained stable regardless of the Ni content. These results show that the Ni–Pd–CNT-assisted nano-epitaxial lateral overgrowth (nano-ELOG) approach effectively reduces threading dislocation density while preserving wide bandgap transparency. This method offers a low-cost, scalable route for producing high-quality α-Ga<sub>2</sub>O<sub>3</sub>, with strong potential for next-generation power electronics and UV optoelectronic devices.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"202 \",\"pages\":\"Article 110144\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125008820\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125008820","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Crack-free thick α-Ga2O3 films grown on Ni–Pd-CNT nanoalloy masks
We report a Ni–Pd–CNT-based nanoalloy mask that improves the crystalline quality of α-Ga2O3 epilayers grown via halide vapor phase epitaxy (HVPE). Conventional heteroepitaxy of α-Ga2O3 on sapphire substrates typically results in high dislocation densities due to lattice and thermal expansion mismatches. To address this problem, a Ni–Pd–CNT nanoalloy layer was deposited on a (0001)-oriented α-Ga2O3 buffer layer using electroless plating and spray coating, and α-Ga2O3 was regrown for 15 min. Among the plating durations tested (20, 40, and 60 s), the 40 s condition yielded the thickest epilayer (∼11 μm), the lowest etch pit density (∼4.8 × 107 cm−2), and the narrowest X-ray diffraction rocking curve for the asymmetric (10–14) reflection.
AFM and SEM analyses confirmed improved surface uniformity and reduced tilting of seed crystals under these conditions. All samples exhibited high optical transmittance (>80 %) in the visible region and a direct bandgap of ∼5.13 eV, which indicates that the optical properties remained stable regardless of the Ni content. These results show that the Ni–Pd–CNT-assisted nano-epitaxial lateral overgrowth (nano-ELOG) approach effectively reduces threading dislocation density while preserving wide bandgap transparency. This method offers a low-cost, scalable route for producing high-quality α-Ga2O3, with strong potential for next-generation power electronics and UV optoelectronic devices.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.