Ni和Ni - n共掺杂CuCrO2薄膜的晶界钝化和晶体取向:通过工艺结构控制提高电学性能和近红外透明度

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jamshina Sanam P.K., P.P. Pradyumnan
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引用次数: 0

摘要

本文研究了合成参数和氮共掺杂对ni掺杂CuCrO2薄膜结构、光学和电学性能的影响。在不同溅射条件下制备了ni掺杂薄膜,然后进行了氮退火和共掺杂,以评估氮在裁剪薄膜特性中的作用。结构研究表明,薄膜的取向和结晶度受溅射功率和气体压力的强烈影响,而氮退火导致晶格膨胀而没有相变。重要的是,氮共掺杂诱导了沿新的晶体平面的优先生长,这归因于改变的附原子动力学和选择性表面钝化。EDX证实了氮气氛下Ni的扩散系数是可变的。电学分析表明,氮退火大大降低了晶界势垒高度(从10.5降至1.23 meV),在300 K时将迁移率提高到11.12 cm2V−1s−1。相比之下,氮共掺杂保留了迁移率,但显著提高了载流子浓度,电导率最高,为9159 S/m。光学研究表明,近红外区的透射率对溅射条件非常敏感,在2000 nm处最大透射率为84.4%。氮退火在不改变带隙的情况下略微降低了透射率,而Ni-N共掺杂引发了Burstein-Moss位移,通过载流子密度的增强扩大了带隙。这些结果证明了过程调优的协同作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Grain boundary passivation and crystallographic reorientation in Ni and Ni–N co-doped CuCrO2 thin films: Enhancing electrical properties and NIR transparency via process–structure control
This work investigates the impact of synthesis parameters and nitrogen co-doping on the structural, optical, and electrical properties of Ni-doped CuCrO2 thin films, a promising p-type transparent conducting oxide. Ni-doped films were fabricated under varying sputtering conditions, followed by nitrogen annealing and co-doping to assess the role of nitrogen in tailoring film characteristics. Structural studies revealed that film orientation and crystallinity are strongly governed by sputtering power and gas pressure, while nitrogen annealing caused lattice expansion without phase change. Importantly, nitrogen co-doping induced preferential growth along a new crystallographic plane, attributed to altered adatom kinetics and selective surface passivation. EDX confirmed variable Ni diffusivity under nitrogen atmospheres. Electrical analysis showed that nitrogen annealing drastically reduced grain boundary potential barrier height (from 10.5 to 1.23 meV), boosting mobility to 11.12 cm2V−1s−1 at 300 K. In contrast, nitrogen co-doping preserved mobility but significantly increased carrier concentration, yielding the highest electrical conductivity of 9159 S/m among all samples. Optical studies revealed that transmittance in the near-infrared region was highly sensitive to sputtering conditions, with a maximum of 84.4% at 2000 nm. Nitrogen annealing slightly reduced transmittance without altering the band gap, whereas Ni–N co-doping triggered a Burstein–Moss shift, widening the band gap via carrier density enhancement. These results demonstrate the synergistic role of process tuning.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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