{"title":"Ni和Ni - n共掺杂CuCrO2薄膜的晶界钝化和晶体取向:通过工艺结构控制提高电学性能和近红外透明度","authors":"Jamshina Sanam P.K., P.P. Pradyumnan","doi":"10.1016/j.mssp.2025.110113","DOIUrl":null,"url":null,"abstract":"<div><div>This work investigates the impact of synthesis parameters and nitrogen co-doping on the structural, optical, and electrical properties of Ni-doped CuCrO<span><math><msub><mrow></mrow><mrow><mn>2</mn></mrow></msub></math></span> thin films, a promising p-type transparent conducting oxide. Ni-doped films were fabricated under varying sputtering conditions, followed by nitrogen annealing and co-doping to assess the role of nitrogen in tailoring film characteristics. Structural studies revealed that film orientation and crystallinity are strongly governed by sputtering power and gas pressure, while nitrogen annealing caused lattice expansion without phase change. Importantly, nitrogen co-doping induced preferential growth along a new crystallographic plane, attributed to altered adatom kinetics and selective surface passivation. EDX confirmed variable Ni diffusivity under nitrogen atmospheres. Electrical analysis showed that nitrogen annealing drastically reduced grain boundary potential barrier height (from 10.5 to 1.23 meV), boosting mobility to 11.12 cm<span><math><msup><mrow></mrow><mrow><mn>2</mn></mrow></msup></math></span>V<sup>−1</sup>s<sup>−1</sup> at 300 K. In contrast, nitrogen co-doping preserved mobility but significantly increased carrier concentration, yielding the highest electrical conductivity of 9159 S/m among all samples. Optical studies revealed that transmittance in the near-infrared region was highly sensitive to sputtering conditions, with a maximum of 84.4% at 2000 nm. Nitrogen annealing slightly reduced transmittance without altering the band gap, whereas Ni–N co-doping triggered a Burstein–Moss shift, widening the band gap via carrier density enhancement. These results demonstrate the synergistic role of process tuning.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"202 ","pages":"Article 110113"},"PeriodicalIF":4.6000,"publicationDate":"2025-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Grain boundary passivation and crystallographic reorientation in Ni and Ni–N co-doped CuCrO2 thin films: Enhancing electrical properties and NIR transparency via process–structure control\",\"authors\":\"Jamshina Sanam P.K., P.P. Pradyumnan\",\"doi\":\"10.1016/j.mssp.2025.110113\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This work investigates the impact of synthesis parameters and nitrogen co-doping on the structural, optical, and electrical properties of Ni-doped CuCrO<span><math><msub><mrow></mrow><mrow><mn>2</mn></mrow></msub></math></span> thin films, a promising p-type transparent conducting oxide. Ni-doped films were fabricated under varying sputtering conditions, followed by nitrogen annealing and co-doping to assess the role of nitrogen in tailoring film characteristics. Structural studies revealed that film orientation and crystallinity are strongly governed by sputtering power and gas pressure, while nitrogen annealing caused lattice expansion without phase change. Importantly, nitrogen co-doping induced preferential growth along a new crystallographic plane, attributed to altered adatom kinetics and selective surface passivation. EDX confirmed variable Ni diffusivity under nitrogen atmospheres. Electrical analysis showed that nitrogen annealing drastically reduced grain boundary potential barrier height (from 10.5 to 1.23 meV), boosting mobility to 11.12 cm<span><math><msup><mrow></mrow><mrow><mn>2</mn></mrow></msup></math></span>V<sup>−1</sup>s<sup>−1</sup> at 300 K. In contrast, nitrogen co-doping preserved mobility but significantly increased carrier concentration, yielding the highest electrical conductivity of 9159 S/m among all samples. Optical studies revealed that transmittance in the near-infrared region was highly sensitive to sputtering conditions, with a maximum of 84.4% at 2000 nm. Nitrogen annealing slightly reduced transmittance without altering the band gap, whereas Ni–N co-doping triggered a Burstein–Moss shift, widening the band gap via carrier density enhancement. These results demonstrate the synergistic role of process tuning.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"202 \",\"pages\":\"Article 110113\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125008510\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125008510","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Grain boundary passivation and crystallographic reorientation in Ni and Ni–N co-doped CuCrO2 thin films: Enhancing electrical properties and NIR transparency via process–structure control
This work investigates the impact of synthesis parameters and nitrogen co-doping on the structural, optical, and electrical properties of Ni-doped CuCrO thin films, a promising p-type transparent conducting oxide. Ni-doped films were fabricated under varying sputtering conditions, followed by nitrogen annealing and co-doping to assess the role of nitrogen in tailoring film characteristics. Structural studies revealed that film orientation and crystallinity are strongly governed by sputtering power and gas pressure, while nitrogen annealing caused lattice expansion without phase change. Importantly, nitrogen co-doping induced preferential growth along a new crystallographic plane, attributed to altered adatom kinetics and selective surface passivation. EDX confirmed variable Ni diffusivity under nitrogen atmospheres. Electrical analysis showed that nitrogen annealing drastically reduced grain boundary potential barrier height (from 10.5 to 1.23 meV), boosting mobility to 11.12 cmV−1s−1 at 300 K. In contrast, nitrogen co-doping preserved mobility but significantly increased carrier concentration, yielding the highest electrical conductivity of 9159 S/m among all samples. Optical studies revealed that transmittance in the near-infrared region was highly sensitive to sputtering conditions, with a maximum of 84.4% at 2000 nm. Nitrogen annealing slightly reduced transmittance without altering the band gap, whereas Ni–N co-doping triggered a Burstein–Moss shift, widening the band gap via carrier density enhancement. These results demonstrate the synergistic role of process tuning.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.