气溶胶火焰合成碳- tio2纳米复合膜的电容耦合非挤压型I-V和II型记忆电阻行为

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Abdul Khalique , Gianluigi De Falco , Patrizia Minutolo , Mario Commodo , Andrea D'Anna
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引用次数: 0

摘要

二氧化钛(TiO2)是一种长期存在的半导体材料,用于多种电气和电子应用,包括随机存取存储器,生物混合接口,传感器和神经形态计算。然而,这些应用仍处于早期发展阶段,受到理解上的根本差距和技术限制的制约。TiO2的功能忆阻特性很大程度上依赖于工艺,包括合成技术、制备和物理化学修饰。在这项工作中,通过定制的气溶胶火焰合成(AFS)反应器,采用简单的一步合成技术,对纳米结构、结晶度、缺陷化学和碳成分夹杂物进行了良好的控制,制备了碳(Soot)和TiO2的纳米结构复合薄膜。采用扫描迁移率粒度仪(SMPS)分析了火焰中的粒径分布。通过拉曼光谱、紫外-可见分光光度法、原子力显微镜(AFM)和电流-电压I-V测量对C-TiO2薄膜的微观结构和组成进行了表征。碳和TiO2的存在通过拉曼光谱得到了证实,并通过光吸收进行了量化。电学表征表明C-TiO2纳米结构薄膜具有电容耦合非零交叉和ii型滞后行为。碳复合后,TiO2在可见光谱区表现出增强的光吸收和电导率。TiO2薄膜和C-TiO2薄膜的I-V测量证明了导电途径的改善。在黑暗和阳光照射后,观察到电容耦合记忆电阻效应消失和重新出现的现象,这很可能是由于纳米复合膜中TiO2的光敏性质。这项概念验证研究证明,由于这些特性,通过AFS生产的C-TiO2纳米复合膜可以被认为是下一代电子器件领域应用的有前途的未来候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Capacitive-coupled non-pinched I–V and type II memristive behavior of carbon-TiO2 nanocomposite films fabricated through aerosol flame synthesis
Titanium dioxide (TiO2) is a long-established semiconductor material used in several electrical and electronical applications, including random-access memories, biohybrid interfaces, sensors, and neuromorphic computing. Nevertheless, such applications are still at an early development stage, constrained by fundamental gaps in understanding and technological limitations. Functional memristive characteristics of TiO2 rely extensively on the processes, including synthesis techniques, fabrication, and physicochemical modifications. In this work, nanostructured composite films of Carbon (Soot) and TiO2 are fabricated through a custom-made aerosol flame synthesis (AFS) reactor using a facile one-step synthesis technique with good control over nanostructure, crystallinity, defect chemistry and carbon component inclusions. Scanning mobility particle sizer (SMPS) was employed to analyze particle size distribution in the flame. Microstructures and composition of the C-TiO2 film were characterized through Raman spectroscopy, UV–VIS spectrophotometry, atomic force microscopy (AFM), and current-voltage I-V measurements. The presence of carbon and TiO2 across the film was confirmed by the Raman spectrum and quantified by light absorption. The electrical characterization demonstrated a capacitive-coupled non-zero crossing and type-II hysteresis behavior of the C-TiO2 nanostructured film. Following carbon compositing, TiO2 exhibited enhanced optical absorption in the visible spectral region and electrical conductivity. The improvement in the conduction pathways was evidenced by the I-V measurements of the TiO2 film and the C-TiO2 film. A phenomenon of disappearance and reappearance of the capacitive-coupled memresistive effect was observed after dark and sunlight exposure, most likely due to the photosensitive nature of TiO2 in the nanocomposite film. This proof-of-concept study testifies that, due to such properties, C-TiO2 nanocomposite films produced via AFS can be considered as promising future candidates for applications in the field of next-generation electronic devices.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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