一种用于可穿戴系统的无电池BLE反向散射通信芯片

IF 2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Solid-State Circuits Letters Pub Date : 2025-09-22 DOI:10.1109/LSSC.2025.3612423

Yongling Zhang;Ji Xiong;Junzai Chen;Xiaoyu Li;Jinrui Zuo;Yan Wang;Xiaoyi Wang;Miao Meng

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引用次数: 0

摘要

这封信介绍了一种反向散射芯片，具有与商品蓝牙低功耗（BLE）收发器双向通信的特点。对于上行链路，该芯片通过提出的基于复制vco的GFSK调制器和无电感的SSB反射器将反向白化的BLE音调反射到单边带（SSB） GFSK调制的BLE数据包中。对于下行链路，通过使用反向白化BLE音调，然后使用拟议的自校准GFSK解调器，被动地进行频率降转换，以超低功耗恢复下行链路数据，并提高鲁棒性。集成了双线极化微带贴片天线（DPMPA），以实现可穿戴形式的并发射频能量收集和通信。该芯片采用65nm CMOS实现，下行功耗为1.4~\mu $ W，上行功耗为15.8~\mu $ W。无线测试表明，在20 dBm EIRP下，下行链路为50 cm，上行链路为bbb30 m。

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A Battery-Free BLE Backscatter Communication Chip for Wearable Systems

This letter presents a backscatter chip that features bidirectional communication with commodity bluetooth low-energy (BLE) transceivers. For uplink, the chip reflects a reverse-whitened BLE tone into single-sideband (SSB) GFSK-modulated BLE packets via a proposed replica VCO-based GFSK modulator and an inductor-free SSB reflector. For downlink, the BLE packets are frequency down-converted passively by utilizing a reverse-whitened BLE tone followed by a proposed self-calibrated GFSK demodulator to recover the downlink data at ultralow power with improved robustness. A dual-linearly polarized microstrip patch antenna (DPMPA) is integrated to enable concurrent RF energy harvesting and communication in a wearable form factor. Implemented in 65-nm CMOS, the chip consumes

$1.4~\mu $

W for downlink and

$15.8~\mu $

W for uplink. Wireless tests demonstrated a 50 cm downlink and >3 m uplink ranges at 20 dBm EIRP.

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