Interface interaction, design, modulation, and optimization of van der Waals two-dimensional materials

An atomically clean interface is crucial for unlocking the full performance potential of van der Waals (vdW) two-dimensional (2D) materials. Their unique interlayer vdW interactions and absence of dangling bonds fundamentally distinguish interface science and engineering from those in conventional semiconductors. Recent research has established a framework centered on interface interaction, design, modulation, and optimization, aimed at mitigating performance degradation arising from interface contamination, strain introduction, and structural damage during material processing, transfer, and heterogeneous integration. Nevertheless, transitioning from individual devices to wafer-scale integrated circuits and developing a vdW 2D material integration platform comparable to silicon-based complementary metal-oxide-semiconductor (CMOS) technology remains a significant challenge. This necessitates systematic interface optimization across the entire “material–process–device” chain. To this end, this review provides a comprehensive overview of recent progress in the fundamental nature of interface forces in vdW 2D materials, high-quality transfer strategies governed by interface forces, and cutting-edge approaches to improving interface quality. We further provide an in-depth analysis of critical bottlenecks related to interface controllability, scalability, and process compatibility, and offer perspectives on future research directions. This work aims to provide valuable guidance for establishing a comprehensive paradigm for end-to-end interface optimization and device integration.