通过外腔耦合的可扩展磁控管阵列的演示

IF 4.5 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wenlong Li;Hailong Li;Wanshan Hou;Hui Wang;Yu Qin;Haixia Liu;Licun Wang;Bo Li;Changnian Li;Maoyan Wang;Liangjie Bi;Bin Wang;Yong Yin;Lin Meng
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引用次数: 0

摘要

这封信首次展示了大规模阵列应用中五个磁控管之间的高效锁相。该阵列分为两个模块,通过基于外部波导的耦合实现锁相。验证实验证实,所有五个磁控管都在2.462 GHz的锁定频率下工作。时域信号采样和分析表明,跨不同模块的非相邻磁控管之间的相位差随时间保持稳定,脉冲间相位波动限制在±4°。总锁相效率达到87.8%。为了确保灵活性和可扩展性,该阵列采用环串联耦合拓扑结构并结合模块化组装策略,使该设计特别适合大规模磁控管阵列应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Demonstration of a Scalable Magnetron Array Through Extracavity Coupling
This letter presents the first demonstration of high-efficiency phase-locking among five magnetrons for large-scale array applications. The array is organized into two modules, with phase-locking achieved through external waveguide-based coupling. Validation experiments confirm that all five magnetrons operate at a locked frequency of 2.462 GHz. Time-domain signal sampling and analysis reveal that the phase difference between nonadjacent magnetrons across different modules remains stable over time, with inter-pulse phase fluctuations constrained within ±4°. The overall phase-locking efficiency reaches 87.8%. To ensure flexibility and scalability, the array adopts a ring-series coupled topology combined with a modular assembly strategy, making the design particularly suited for large-scale magnetron array applications.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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