衬底偏压驱动溅射沉积β相主导钨薄膜用于自旋电子应用

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS
Abhay Singh Rajawat , Naim Ahmad , Risvana Nasril , Tasneem Sheikh , Mohammad Muhiuddin , Savita Sahu , Ashwani Gautam , Arvind Kumar , Md. Imteyaz Ahmad , G.A. Basheed , Mohammad R. Rahman , Waseem Akhtar
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引用次数: 0

摘要

β-钨(β-W)是钨的A15立方相,与bcc相α-钨(α-W)相比,具有巨大的自旋霍尔角,使高质量的β-W薄膜成为自旋电子应用的理想选择。我们报道了通过直流溅射在SiO2/Si衬底上控制β- w薄膜的生长,其中衬底偏压通过调节沉积原子的能量来稳定β相是关键因素。这种方法可以在很宽的厚度范围内形成β-W薄膜。原子力显微镜图像的功率谱密度分析表明,在+50 V的正衬底偏压下生长的β-W膜具有低表面粗糙度和小晶粒尺寸。此外,我们还研究了通过衬底偏压实现的不同钨相的自旋抽运现象。铁磁共振测量表明,与α-W/Py为主的薄膜相比,β-W/Py的磁阻尼增强。重要的是,使用衬底偏压不会降低界面质量,强调其有效性。这些发现突出了衬底偏压在薄膜工程中的潜力,为其在自旋电子应用中的先进应用铺平了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate-bias driven sputter deposited β-phase dominated tungsten film for spintronic applications
β-Tungsten (β-W), an A15 cubic phase of tungsten, exhibits a giant spin Hall angle compared to its bcc-phase α-Tungsten (α-W), making high-quality β-W films desirable for spintronic applications. We report the controlled growth of β-W films on SiO2/Si substrates via DC sputtering, where substrate bias serves as a critical factor in stabilizing the β phase by regulating the energy of deposited atoms. This approach enables the formation of β-W films over a wide thickness range. Power spectral density analysis of the atomic force microscopy images revealed that the β-W film grown at a positive substrate bias of +50 V exhibits low surface roughness along with small grain size. Additionally, we studied the spin pumping phenomena in different tungsten phases achieved through substrate bias. Ferromagnetic resonance measurements reveal an enhancement in the magnetic damping for β-W/Py compared to α-W/Py dominated film. Importantly, the use of substrate bias does not deteriorate the interface quality, underscoring its effectiveness. These findings highlight the potential of substrate bias in thin-film engineering, paving the way for its advanced utilization in spintronic applications.
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来源期刊
Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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