Mohammad M. Hamasha , Sa'd Hamasha , Khalid Alzoubi , Raghad Massadeh , Khozima Hamasha
{"title":"柔性电子用PET基板上ITO和AZO薄膜的机械和热应力比较分析","authors":"Mohammad M. Hamasha , Sa'd Hamasha , Khalid Alzoubi , Raghad Massadeh , Khozima Hamasha","doi":"10.1016/j.microrel.2025.115921","DOIUrl":null,"url":null,"abstract":"<div><div>This study investigates the mechanical and thermal characteristics of indium tin oxide (ITO) and aluminum-doped zinc oxide (AZO) thin films on flexible polyethylene terephthalate (PET) substrates. The percentage change in electrical resistance (PCER) was investigated through cyclic bending fatigue, thermal cycling, and thermal aging tests to simulate the film's degradation over time under conditions similar to real-life use. Results reveal that AZO films are more prone to crack development and resistance increase under mechanical and thermal stress, especially at elevated temperatures. ITO films proved to be more stable and have smaller PCER values with superior performance under long-term stress. The findings pinpoint ITO's superior mechanical and thermal reliability when compared with AZO and its applicability in long-term flexible electronic devices. This comparative study presents important evidence towards the stability of transparent conductive oxides (TCOs) on flexible substrates and educates the selection of material in stable, resilient, and flexible optoelectronic and photovoltaic devices.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"175 ","pages":"Article 115921"},"PeriodicalIF":1.9000,"publicationDate":"2025-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications\",\"authors\":\"Mohammad M. Hamasha , Sa'd Hamasha , Khalid Alzoubi , Raghad Massadeh , Khozima Hamasha\",\"doi\":\"10.1016/j.microrel.2025.115921\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study investigates the mechanical and thermal characteristics of indium tin oxide (ITO) and aluminum-doped zinc oxide (AZO) thin films on flexible polyethylene terephthalate (PET) substrates. The percentage change in electrical resistance (PCER) was investigated through cyclic bending fatigue, thermal cycling, and thermal aging tests to simulate the film's degradation over time under conditions similar to real-life use. Results reveal that AZO films are more prone to crack development and resistance increase under mechanical and thermal stress, especially at elevated temperatures. ITO films proved to be more stable and have smaller PCER values with superior performance under long-term stress. The findings pinpoint ITO's superior mechanical and thermal reliability when compared with AZO and its applicability in long-term flexible electronic devices. This comparative study presents important evidence towards the stability of transparent conductive oxides (TCOs) on flexible substrates and educates the selection of material in stable, resilient, and flexible optoelectronic and photovoltaic devices.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"175 \",\"pages\":\"Article 115921\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2025-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271425003348\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425003348","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications
This study investigates the mechanical and thermal characteristics of indium tin oxide (ITO) and aluminum-doped zinc oxide (AZO) thin films on flexible polyethylene terephthalate (PET) substrates. The percentage change in electrical resistance (PCER) was investigated through cyclic bending fatigue, thermal cycling, and thermal aging tests to simulate the film's degradation over time under conditions similar to real-life use. Results reveal that AZO films are more prone to crack development and resistance increase under mechanical and thermal stress, especially at elevated temperatures. ITO films proved to be more stable and have smaller PCER values with superior performance under long-term stress. The findings pinpoint ITO's superior mechanical and thermal reliability when compared with AZO and its applicability in long-term flexible electronic devices. This comparative study presents important evidence towards the stability of transparent conductive oxides (TCOs) on flexible substrates and educates the selection of material in stable, resilient, and flexible optoelectronic and photovoltaic devices.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.