Zilan Wang , Hongling Wu , Haoyang Li , Jiaxuan Yang , Francis C.C. Ling , Lai Wang
{"title":"界面状态电特性的实用指南:SiC和GaN的案例研究","authors":"Zilan Wang , Hongling Wu , Haoyang Li , Jiaxuan Yang , Francis C.C. Ling , Lai Wang","doi":"10.1016/j.mssp.2025.110050","DOIUrl":null,"url":null,"abstract":"<div><div>SiC and GaN have garnered significant attention from both academia and industry due to their promising applications. However, interface states in these devices have become a critical performance-limiting factor. Furthermore, as novel device architectures continue to evolve, the characterization of interface states presents increasingly complex challenges. Among available techniques, electrical defect characterization methods have emerged as indispensable tools for investigating interface states due to their non-destructive nature, rapid measurement capabilities, cost-effectiveness, and ability to provide comprehensive parameters—including energy distribution, energy levels, and capture cross-sections. This tutorial highlights three widely used electrical characterization techniques for interface state analysis: capacitance-voltage (CV) profiling, the conductance method, and constant-capacitance deep-level transient spectroscopy (CC-DLTS). Each technique has demonstrated value within specific measurement ranges, and practical experience suggests that combining multiple approaches often yields the most reliable results. The discussion includes fundamental principles, implementation considerations, and case studies from actual device measurements, aiming to provide experimental researchers with practical guidance. With a focus on SiC and GaN, this guide seeks to offer actionable starting points for characterizing interface states, particularly for those new to these measurement techniques.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"201 ","pages":"Article 110050"},"PeriodicalIF":4.6000,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A practical guide to electrical characterization of interface states: Case studies on SiC and GaN\",\"authors\":\"Zilan Wang , Hongling Wu , Haoyang Li , Jiaxuan Yang , Francis C.C. Ling , Lai Wang\",\"doi\":\"10.1016/j.mssp.2025.110050\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>SiC and GaN have garnered significant attention from both academia and industry due to their promising applications. However, interface states in these devices have become a critical performance-limiting factor. Furthermore, as novel device architectures continue to evolve, the characterization of interface states presents increasingly complex challenges. Among available techniques, electrical defect characterization methods have emerged as indispensable tools for investigating interface states due to their non-destructive nature, rapid measurement capabilities, cost-effectiveness, and ability to provide comprehensive parameters—including energy distribution, energy levels, and capture cross-sections. This tutorial highlights three widely used electrical characterization techniques for interface state analysis: capacitance-voltage (CV) profiling, the conductance method, and constant-capacitance deep-level transient spectroscopy (CC-DLTS). Each technique has demonstrated value within specific measurement ranges, and practical experience suggests that combining multiple approaches often yields the most reliable results. The discussion includes fundamental principles, implementation considerations, and case studies from actual device measurements, aiming to provide experimental researchers with practical guidance. With a focus on SiC and GaN, this guide seeks to offer actionable starting points for characterizing interface states, particularly for those new to these measurement techniques.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"201 \",\"pages\":\"Article 110050\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125007875\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125007875","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A practical guide to electrical characterization of interface states: Case studies on SiC and GaN
SiC and GaN have garnered significant attention from both academia and industry due to their promising applications. However, interface states in these devices have become a critical performance-limiting factor. Furthermore, as novel device architectures continue to evolve, the characterization of interface states presents increasingly complex challenges. Among available techniques, electrical defect characterization methods have emerged as indispensable tools for investigating interface states due to their non-destructive nature, rapid measurement capabilities, cost-effectiveness, and ability to provide comprehensive parameters—including energy distribution, energy levels, and capture cross-sections. This tutorial highlights three widely used electrical characterization techniques for interface state analysis: capacitance-voltage (CV) profiling, the conductance method, and constant-capacitance deep-level transient spectroscopy (CC-DLTS). Each technique has demonstrated value within specific measurement ranges, and practical experience suggests that combining multiple approaches often yields the most reliable results. The discussion includes fundamental principles, implementation considerations, and case studies from actual device measurements, aiming to provide experimental researchers with practical guidance. With a focus on SiC and GaN, this guide seeks to offer actionable starting points for characterizing interface states, particularly for those new to these measurement techniques.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.