基于混合集成悬索线技术的低损耗自封装全移相反射式移相器

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jin Wu;Yuefeng Hou;Liqi Yang;Zhenshuai Fu;Meicheng Liu;Dawei Zhang;Mingtao Zhang;Kaixue Ma
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引用次数: 0

摘要

介绍了一种基于混合集成悬吊线(HISL)技术的低损耗自封装全移相反射式移相器(RTPS)。所提出的RTPS由一个90°分支线耦合器和两个可调谐的并联L-C负载组成,该负载连接到直通端口和耦合端口。首先,提出了一种增强的两步相位提取方法,减少了RTPS的评估状态,在保持状态数不变的情况下实现了最小相位步长;其次,设计中采用HISL技术,实现低插入损耗(IL)。由于HISL的自封装特性,所提出的RTPS有效地避免了对周围电路的干扰,并且集成度高。第三,采用带总线接口的低功耗数字可调谐电容(DTC)作为可调谐负载,使RTPS易于集成到大规模相控阵系统中。最后,采用钣金和PCB工艺制作了原型机。在中心频率为2.45 GHz时,该RTPS在128种扫描状态下的相移范围(PSR)为368°,IL为0.9 ~ 1.6 dB,性能值(FoM)为230°/dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-Loss Self-Packaged Full Phase Shift Reflection-Type Phase Shifter Based on Hybrid Integrated Suspended Line Technology
A low-loss and self-packaged full phase shift reflection-type phase shifter (RTPS) based on the hybrid integrated suspended line (HISL) technology is introduced. The proposed RTPS consists of a 90° branch line coupler and two tunable parallel L–C loads connected to the through port and coupled ports. First, an enhanced two-step phase extraction method is proposed, reducing the evaluation state of the RTPS and achieving the minimal phase step while keeping the number of states unchanged. Second, the HISL technology is adopted in the design to achieve low insertion loss (IL). Due to the self-packaging characteristics of HISL, the proposed RTPS effectively avoids interference with surrounding circuits and is highly integrated. Third, the low-power digital tunable capacitor (DTC) with a bus interface is used as the tunable load, making the RTPS easy to integrate into large-scale phased array systems. Finally, a prototype is fabricated by using the sheet metal and PCB process. At the center frequency of 2.45 GHz, the proposed RTPS achieved a measured phase shift range (PSR) of 368° under 128 sweeping states with an IL of 0.9–1.6 dB, and the figure of merit (FoM) is 230°/dB.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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