用于单片量子处理器的量子比特大小的低功耗低温CMOS集成电路

IF 2.6 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Domenico Zito
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引用次数: 0

摘要

本文解决了实现微波和毫米波控制和读出ic的严峻设计挑战,从而实现了单片硅量子处理器(QPs)。我们第一次在一个统一的框架内描述电路设计挑战,并提供一些关于要求,技术和性能的一般考虑,作为未来发展的参考。为了支持讨论和考虑,我们还报告了一些结果,这些结果来自于我们在研究和开发中对单片qp的设想和执行。特别是,我们解决了导致新的设计范式的关键方面,使量子比特大小的低功耗CMOS ic能够用于单片量子比特的量子比特控制和读出,并总结了一些代表性关键构建块所展示的主要特性和结果。这些电路解决方案打开了一类新的低功耗毫米波电路,由几个mosfet组成,没有螺旋电感器或其他大型和有损耗的分布式无源元件,导致特征尺寸接近我们的量子位器件,即-量子位大小的低功耗低温ic,作为可扩展到大量量子位的单片QPs的关键解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Qubit-size low-power cryogenic CMOS ICs for monolithic quantum processors

Qubit-size low-power cryogenic CMOS ICs for monolithic quantum processors
This manuscript addresses the severe design challenge for the implementation of microwave and mm-wave control-and-readout ICs enabling the implementation of monolithic Silicon quantum processors (QPs).
For the first time, we describe the circuit design challenge within a unitary frame and provide some general considerations about requirements, technology and performances, as a reference for future developments. In support of the discussion and considerations, we report also some results emerged from our work envisioned and carried out within our research and developments toward monolithic QPs. In particular, we address the key aspects leading to the new design paradigm enabling qubit-size low-power CMOS ICs for qubit control and readout for monolithic QPs and summarize the main characteristics and results exhibited by some representative key building blocks. These circuit solutions open to a new class of low-power mm-wave circuits made of a few MOSFETs, without spiral inductors or other large and lossy distributed passive components, resulting in a characteristic size close to our qubit devices, namely — qubit-size low-power cryogenic ICs, as key enabling solutions for monolithic QPs scalable to a large number of qubits.
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来源期刊
Microprocessors and Microsystems
Microprocessors and Microsystems 工程技术-工程:电子与电气
CiteScore
6.90
自引率
3.80%
发文量
204
审稿时长
172 days
期刊介绍: Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC). Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.
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