{"title":"一种基于重置冗余强化的单事件干扰容限DICE触发器设计","authors":"Yaohua Xu;Zeteng Liu;Yi Wang;Na Bai;Ye Liu","doi":"10.1109/TDMR.2025.3570099","DOIUrl":null,"url":null,"abstract":"The standard cell library forms the foundation of chip design. Conducting rational and efficient radiation-hardening design and performance verification for the library is essential to ensure the safe on-orbit operation of aerospace components. This paper investigates the resettable dual interlocked storage cell (DICE) flip-flop (DICE-FF) from a radiation-hardened cell library and proposes a flip-flop (DICE-REFF) with reset-redundant control circuitry to improve its radiation tolerance. The study examines the effects of Single Event Upset (SEU) both before and after the redundancy hardening of the reset control, identifying sensitive layout regions and critical circuit nodes. Simulations show that the redundancy-hardened DICE-REFF demonstrates strong SEU tolerance, with a Linear Energy Transfer (LET) threshold of 37 MeV/mg/cm2. Additionally, the circuit area increased by only 5% compared to the non-hardened design, with no loss in performance. Additionally, a test chip was designed, and the SEU resistance of the flip-flop was validated through both fault injection and irradiation experiment. The study also explores the impact of different implementation strategies on fault rates.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 3","pages":"501-509"},"PeriodicalIF":2.3000,"publicationDate":"2025-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A DICE Flip-Flop Design by Resetting Redundancy Hardening for Single Event Upset Tolerance\",\"authors\":\"Yaohua Xu;Zeteng Liu;Yi Wang;Na Bai;Ye Liu\",\"doi\":\"10.1109/TDMR.2025.3570099\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The standard cell library forms the foundation of chip design. Conducting rational and efficient radiation-hardening design and performance verification for the library is essential to ensure the safe on-orbit operation of aerospace components. This paper investigates the resettable dual interlocked storage cell (DICE) flip-flop (DICE-FF) from a radiation-hardened cell library and proposes a flip-flop (DICE-REFF) with reset-redundant control circuitry to improve its radiation tolerance. The study examines the effects of Single Event Upset (SEU) both before and after the redundancy hardening of the reset control, identifying sensitive layout regions and critical circuit nodes. Simulations show that the redundancy-hardened DICE-REFF demonstrates strong SEU tolerance, with a Linear Energy Transfer (LET) threshold of 37 MeV/mg/cm2. Additionally, the circuit area increased by only 5% compared to the non-hardened design, with no loss in performance. Additionally, a test chip was designed, and the SEU resistance of the flip-flop was validated through both fault injection and irradiation experiment. The study also explores the impact of different implementation strategies on fault rates.\",\"PeriodicalId\":448,\"journal\":{\"name\":\"IEEE Transactions on Device and Materials Reliability\",\"volume\":\"25 3\",\"pages\":\"501-509\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2025-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Device and Materials Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11004062/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11004062/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A DICE Flip-Flop Design by Resetting Redundancy Hardening for Single Event Upset Tolerance
The standard cell library forms the foundation of chip design. Conducting rational and efficient radiation-hardening design and performance verification for the library is essential to ensure the safe on-orbit operation of aerospace components. This paper investigates the resettable dual interlocked storage cell (DICE) flip-flop (DICE-FF) from a radiation-hardened cell library and proposes a flip-flop (DICE-REFF) with reset-redundant control circuitry to improve its radiation tolerance. The study examines the effects of Single Event Upset (SEU) both before and after the redundancy hardening of the reset control, identifying sensitive layout regions and critical circuit nodes. Simulations show that the redundancy-hardened DICE-REFF demonstrates strong SEU tolerance, with a Linear Energy Transfer (LET) threshold of 37 MeV/mg/cm2. Additionally, the circuit area increased by only 5% compared to the non-hardened design, with no loss in performance. Additionally, a test chip was designed, and the SEU resistance of the flip-flop was validated through both fault injection and irradiation experiment. The study also explores the impact of different implementation strategies on fault rates.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.