相参稀钌增强钴膜与改善热稳定性和击穿强度互连金属化

IF 2 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS

Thin Solid Films Pub Date : 2025-09-09 DOI:10.1016/j.tsf.2025.140792

Yi-Yen Chen, Jun-Neng Zhan, Jau-Shiung Fang

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引用次数: 0

摘要

采用400℃共溅射的方法，在热氧化硅衬底上合成了含有微量Ru的钴-钌（Co(Ru)）合金薄膜。结构分析证实，在六方密排相和面心立方相中均形成了完全混相的固溶体，退火后结晶度显著提高。与纯Co相比，所有Co（Ru）薄膜都表现出更高的电气可靠性，击穿电压增加证明了这一点。由于溶质引起的晶格畸变，随着Ru含量的增加，电阻率略有增加，而Co（Ru-1.28 at%）薄膜达到了最佳平衡，在700℃退火后表现出最低的电阻率、优异的热稳定性和光滑无空洞的表面。这些发现表明，稀释Ru的掺入是提高Co基薄膜结构完整性和电性能的有效策略，突出了Co（Ru）作为未来纳米级半导体器件互连应用的潜在候选者。

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Phase-coherent dilute ruthenium-enhanced cobalt films with improved thermal stability and breakdown strength for interconnect metallization

Cobalt-ruthenium (Co(Ru)) alloy films with trace amount of Ru were synthesized on thermally oxidized silicon substrates via co-sputtering at 400 °C. Structural analyses confirmed the formation of fully miscible solid solutions in both hexagonal close-packed and face-centered cubic phases, with crystallinity significantly improved after annealing. All Co(Ru) films exhibited enhanced electrical reliability compared to pure Co, as evidenced by increased breakdown voltages. While resistivity increased slightly with higher Ru content due to solute-induced lattice distortion, the Co(Ru-1.28 at%) film achieved an optimal balance, exhibiting the lowest resistivity, excellent thermal stability, and a smooth, void-free surface after annealing at 700 °C. These findings indicate the dilute Ru incorporation as an effective strategy to enhance the structural integrity and electrical performance of Co-based thin films, highlighting Co(Ru) as a potential candidate for future interconnect applications in nanoscale semiconductor devices.

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来源期刊

Thin Solid Films 工程技术-材料科学：膜

CiteScore

4.00

自引率

4.80%

发文量

381

审稿时长

7.5 months

期刊介绍： Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.