具有优化的多区浮场环的4H-SiC p沟道igbt高阻塞电压和低导通电压降

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Ruixue Mai , Xiaoli Tian , Xinyu Liu , Xinhua Wang , Yun Bai , Wei Wei , Yuhao Guo , Chengyue Yang , Chengzhan Li , Yidan Tang
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引用次数: 0

摘要

针对4h -碳化硅(4H-SiC) p沟道绝缘栅双极晶体管(igbt),提出、制作并测量了一种新的多区浮动场环(M−FFR)边缘端接结构。这种M−FFR设计有效地抑制了终端边缘的电场拥挤,同时保持了对氧化物电荷积累的高容忍度。数值模拟表明,与传统的等距浮动场环(Con-FFR)设计相比,M−FFR实现了17.4%的高阻断电压。重要的是,所提出的结构不需要复杂的制造步骤或额外的光刻工艺,降低了制造成本和复杂性。为了进一步提高器件性能,采用了载波寿命增强技术来降低导通电压降(Vf)。实验测量证实,制备的p沟道SiC igbt能够承受超过10 kV的阻塞电压,泄漏电流低于300nA。在−20 V的栅极电压下,获得了5.77 V的Vf和17.5 mΩ·cm2的低差分比导通电阻(Ron,sp,diff)。这些结果表明,该器件在大功率电子器件中具有广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High blocking voltage and low on-state voltage drop 4H-SiC p-channel IGBTs with optimized multizone floating field rings
A novel multizone floating field ring (M−FFR) edge termination structure with individually increasing ring spacing has been proposed, fabricated, and measured for 4H-silicon carbide (4H-SiC) p-channel insulated gate bipolar transistors (IGBTs). This M−FFR design effectively suppresses electric field crowding at the termination edge while maintaining a high tolerance to oxide charge accumulation. Numerical simulations indicate that the M−FFR achieves a 17.4 % higher blocking voltage compared to conventional equidistant floating field ring (Con-FFR) designs. Importantly, the proposed structure requires no complex fabrication steps or additional lithography processes, reducing manufacturing cost and complexity. To further enhance device performance, carrier lifetime enhancement techniques were applied to reduce the on-state voltage drop (Vf). Experimental measurements confirm that the fabricated p-channel SiC IGBTs are capable of sustaining blocking voltages exceeding 10 kV with leakage currents below 300nA. At a gate voltage of −20 V, a Vf of 5.77 V and a low differential specific on-resistance (Ron,sp,diff) of 17.5 mΩ·cm2 were achieved. These results suggest that the device is promising for applications in high-power electronic devices.
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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