电子辐照和热循环对SiC MOSFET电性能的影响

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiao Chen;Yadi Xu;Rongxing Cao;Bo Mei;Hanxun Liu;Weixiang Zhou;Zihua Feng;Yuxiong Xue;Yang Liu
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引用次数: 0

摘要

SiC MOSFET由于其优异的物理性能在航空航天领域的功率器件应用中发挥着重要的作用,但其性能仍面临着空间温度变化和高强度辐射的严峻挑战。本文研究了电子辐照和热循环对SiC MOSFET器件的影响。实验和仿真结果表明,电子辐照使氧化物捕获大量正电荷,导致阈值电压负漂移。当辐照剂量为1Mrad时,阈值电压降低17%。热循环在SiC/SiO2界面处引起应力集中,导致界面处晶格位错和失配,使电荷量增加。经过120个循环后,器件的阈值电压降低了32.75%。在此基础上,对同一器件依次进行电子辐照和热循环。实验结果表明,热循环会进一步加剧电子辐照引起的阈值电压漂移。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Electron Irradiation and Thermal Cycling on Electrical Properties of SiC MOSFET
SiC MOSFET plays an important role in the application of power devices in the aerospace field due to its excellent physical properties, but its performance still faces severe challenges from temperature changes and high-intensity radiation in space. In this work, the effects of electron irradiation and thermal cycles on SiC MOSFET devices were studied. The experimental and simulation results show that the electron irradiation makes oxide capture a large number of positive charges, which leads to the negative drift of threshold voltage. When the irradiation dose is 1Mrad, the threshold voltage is reduced by 17%. The thermal cycling induced stress concentration at the SiC/SiO2 interface results in lattice dislocation and mismatch at the interface, which increases the amount of charge. After 120 cycles, the threshold voltage of the devices is reduced by 32.75%. On this basis, the same device was subjected to electron irradiation and thermal cycling in turn. The experimental results show that thermal cycling can further aggravate the threshold voltage drift induced by electron irradiation.
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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