采用混合电子-光子互连的太赫兹片上通信

IF 3.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Terahertz Science and Technology Pub Date : 2025-08-01 DOI:10.1109/TTHZ.2025.3594895

Daiki Ichikawa;Weijie Gao;Nguyen H. Ngo;Takahiro Ohara;Michihiko Tanaka;Shuichi Murakami;Yoshiharu Yamada;Hidemasa Yamane;Yosuke Nishida;Masayuki Fujita;Tadao Nagatsuma

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引用次数: 0

摘要

提出了一种基于硅波导的太赫兹片上通信互连方案，该互连方案采用单载波光电二极管作为发射器，谐振隧道二极管作为接收器。该互连在WR-2.8频段（260-390 GHz）的宽带宽上实现了低传输损耗。实验结果成功地证明了采用32-QAM调制的中频传输速率高达100gb /s，误码率保持在硬判决前向纠错限制内。这些成就突出了所提出的互连方案的潜力，为下一代通信应用推进高性能、紧凑和可扩展的太赫兹集成系统。

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Terahertz On-Chip Communications With Hybrid Electronic-Photonic Interconnects

A silicon waveguide-based interconnection is proposed for terahertz on-chip communications in the 300-GHz band, featuring the integration of a uni-traveling-carrier photodiode as a transmitter and a resonant tunneling diode as a receiver. The interconnection achieves low transmission loss over a broad bandwidth spanning the WR-2.8 band (260–390 GHz). Experimental results successfully demonstrate intermediate frequency transmission at a data rate of up to 100 Gb/s using 32-QAM modulation, with the bit error rate remaining within the hard-decision forward-error correction limit. These achievements highlight the potential of the proposed interconnection scheme to advance high-performance, compact, and scalable terahertz integrated systems for next-generation communications applications.

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来源期刊

IEEE Transactions on Terahertz Science and Technology ENGINEERING, ELECTRICAL & ELECTRONIC-OPTICS

CiteScore

7.10

自引率

9.40%

发文量

102

期刊介绍： IEEE Transactions on Terahertz Science and Technology focuses on original research on Terahertz theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of Terahertz waves.