基于对数位置尺度分布族的循环加速寿命试验数据可靠性分析及其在焊点数据中的应用

IF 5.7 2区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Wenhan Zhang;Xiaojun Zhu;Mu He;Narayanaswamy Balakrishnan
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引用次数: 0

摘要

由于在正常工作条件下测试高质量产品所涉及的高成本,加速寿命试验被广泛采用。对于在工作环境中承受持续波动应力的产品,循环应力测试是必要的。Coffin-Manson模型通常用于产品故障仅归因于温度变化($\ δ T$)。然而,这种假设在许多实际情况下并不总是成立。Norris-Landzberg模型考虑了最高温度和循环变化频率,在模拟由循环温度波动引起的疲劳寿命时提供了很大的灵活性。基于Norris-Landzberg模型已经进行了几项研究。然而,使用多元线性回归方法而不做任何分布假设,可能无法提供令人满意的推理结果。本文假设了对数位置尺度的分布,然后证明了基于故障时间阶统计量的加权最小二乘法在完全数据和ii型截除数据的情况下产生参数的最佳线性无偏估计量(BLUEs)。然后,我们使用理论和蒙特卡罗模拟研究了这些布鲁斯的一些特性。接下来,我们提出一个涉及焊点数据的说明性示例,以演示这里开发的模型和相关推断结果。最后,讨论了优化设计过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data
Accelerated life testing is widely employed due to the high cost involved in testing high-quality products under normal operating conditions. For products exposed to continuously fluctuating stress in the working environment, cyclic stress tests become necessary. The Coffin–Manson model is commonly used when product failure is solely attributed to temperature changes ($\Delta T$). However, this assumption does not always hold in many practical situations. The Norris–Landzberg model, which considers both maximum temperature and cyclic change frequency, offers much flexibility in modeling fatigue life due to cyclic temperature fluctuations. Several studies have been conducted based on the Norris–Landzberg model. However, using the multiple linear regression method without any distributional assumption may fail to provide satisfactory inferential results. This article assumes the log-location-scale family of distributions and then shows that the weighted least-squares method based on order statistics of failure times yields the best linear unbiased estimators (BLUEs) of parameters based on complete as well as Type-II censored data. We then study some properties of these BLUEs using both theory and Monte Carlo simulations. Next, we present an illustrative example involving solder joint data to demonstrate the model and the associate inferential results developed here. Finally, the optimal design procedure is discussed.
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来源期刊
IEEE Transactions on Reliability
IEEE Transactions on Reliability 工程技术-工程:电子与电气
CiteScore
12.20
自引率
8.50%
发文量
153
审稿时长
7.5 months
期刊介绍: IEEE Transactions on Reliability is a refereed journal for the reliability and allied disciplines including, but not limited to, maintainability, physics of failure, life testing, prognostics, design and manufacture for reliability, reliability for systems of systems, network availability, mission success, warranty, safety, and various measures of effectiveness. Topics eligible for publication range from hardware to software, from materials to systems, from consumer and industrial devices to manufacturing plants, from individual items to networks, from techniques for making things better to ways of predicting and measuring behavior in the field. As an engineering subject that supports new and existing technologies, we constantly expand into new areas of the assurance sciences.
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