{"title":"体反馈场效应晶体管","authors":"Hakin Kim;Doohyeok Lim","doi":"10.1109/LED.2025.3588262","DOIUrl":null,"url":null,"abstract":"A feedback field-effect transistor (FBFET) fabricated on a bulk Si substrate is presented. The bulk FBFET features a dual-well structure with multiple p-n junctions on the substrate. This novel structure prevents body leakage and ensures reliable FBFET operation. The bulk FBFET demonstrates unique electrical characteristics, including drain–source current (<inline-formula> <tex-math>${I}_{\\text {DS}}\\text {)}$ </tex-math></inline-formula> latch-up, latch-down, and hysteresis. During <inline-formula> <tex-math>${I}_{\\text {DS}}$ </tex-math></inline-formula> latch-up and latch-down, the bulk FBFET exhibits an extremely low subthreshold swing of less than 1 mV/dec and a high on/off ratio of <inline-formula> <tex-math>$5.71 \\times 10^{{5}}$ </tex-math></inline-formula>.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 9","pages":"1457-1460"},"PeriodicalIF":4.5000,"publicationDate":"2025-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bulk Feedback Field-Effect Transistor\",\"authors\":\"Hakin Kim;Doohyeok Lim\",\"doi\":\"10.1109/LED.2025.3588262\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A feedback field-effect transistor (FBFET) fabricated on a bulk Si substrate is presented. The bulk FBFET features a dual-well structure with multiple p-n junctions on the substrate. This novel structure prevents body leakage and ensures reliable FBFET operation. The bulk FBFET demonstrates unique electrical characteristics, including drain–source current (<inline-formula> <tex-math>${I}_{\\\\text {DS}}\\\\text {)}$ </tex-math></inline-formula> latch-up, latch-down, and hysteresis. During <inline-formula> <tex-math>${I}_{\\\\text {DS}}$ </tex-math></inline-formula> latch-up and latch-down, the bulk FBFET exhibits an extremely low subthreshold swing of less than 1 mV/dec and a high on/off ratio of <inline-formula> <tex-math>$5.71 \\\\times 10^{{5}}$ </tex-math></inline-formula>.\",\"PeriodicalId\":13198,\"journal\":{\"name\":\"IEEE Electron Device Letters\",\"volume\":\"46 9\",\"pages\":\"1457-1460\"},\"PeriodicalIF\":4.5000,\"publicationDate\":\"2025-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electron Device Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11078364/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11078364/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A feedback field-effect transistor (FBFET) fabricated on a bulk Si substrate is presented. The bulk FBFET features a dual-well structure with multiple p-n junctions on the substrate. This novel structure prevents body leakage and ensures reliable FBFET operation. The bulk FBFET demonstrates unique electrical characteristics, including drain–source current (${I}_{\text {DS}}\text {)}$ latch-up, latch-down, and hysteresis. During ${I}_{\text {DS}}$ latch-up and latch-down, the bulk FBFET exhibits an extremely low subthreshold swing of less than 1 mV/dec and a high on/off ratio of $5.71 \times 10^{{5}}$ .
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.