p-GaN栅极AlGaN/GaN hemt中动态导通电阻的独特表面钝化化学计量依赖及其抑制

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Rasik Rashid Malik;Vipin Joshi;Saniya Syed Wani;Simran R. Karthik;Rajarshi Roy Chaudhuri;Avinas N. Shaji;Zubear Khan;Mayank Shrivastava
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引用次数: 0

摘要

在这项工作中,我们展示了通过调整非原位沉积表面钝化层的化学计量来减轻p-GaN栅极AlGaN/GaN hemt中的动态导通电阻。详细的实验采用高电压纳秒脉冲测量和快速开关脉冲序列来分析器件的动态导通电阻行为。基于频率的分析、电致发光分析、衬底偏置依赖性和自热轮廓分析与电特性结合使用,以深入了解与表面钝化化学计量学的动态导通电阻依赖性相关的物理机制。最后,x射线光电子能谱、阴极发光和电容电压分析表明,非化学计量SiOX钝化可以降低表面陷阱密度,从而提高动态导通电阻。这些发现确立了表面钝化化学计量学是缓解gan基功率器件中动态导通电阻问题的关键设计参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Unique Surface Passivation Stoichiometry Dependence of Dynamic On-Resistance and Its Suppression in p-GaN Gate AlGaN/GaN HEMTs
In this work, we demonstrate the mitigation of dynamic on-resistance in p-GaN gate AlGaN/GaN HEMTs by tuning the stoichiometry of an ex-situ deposited surface passivation layer. Detailed experiments using high-voltage nanosecond pulsed measurements and a fast-switching train of pulses are employed to analyze the dynamic on-resistance behavior of the devices. Frequency-based analysis, electroluminescence analysis, substrate bias dependence, and self-heating profile analysis are used in conjunction with electrical characterization to gain insights into the physical mechanisms related to the dynamic on-resistance dependence on surface passivation stoichiometry. Finally, X-ray photoelectron spectroscopy, cathodoluminescence, and capacitance–voltage analysis reveal that the reduction in surface trap density with nonstoichiometric SiOX passivation leads to improved dynamic on-resistance. These findings establish surface passivation stoichiometry as a critical design parameter for alleviating the problem of dynamic on-resistance in GaN-based power devices.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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