cfet中寄生电容的综合研究:一个分析的视角

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Aishwarya Singh;Jaisingh Pal;Om Maheshwari;Nihar R. Mohapatra
{"title":"cfet中寄生电容的综合研究:一个分析的视角","authors":"Aishwarya Singh;Jaisingh Pal;Om Maheshwari;Nihar R. Mohapatra","doi":"10.1109/TED.2025.3585907","DOIUrl":null,"url":null,"abstract":"This work presents a comprehensive study on parasitic capacitance and its corresponding analytical model for complementary field-effect transistor (CFET) devices. The model accounts for various capacitance components, including parallel plate, perpendicular and coplanar plate fringing, junction, separator, and offset capacitances between the gate and source/drain. Individual parasitic capacitance components are isolated using TCAD simulations by adjusting the geometrical and material properties of the device. The fringing capacitance components are modeled using the elliptical integral method, and the model effectively captures the significant contribution of separator capacitance (~20%) to the total parasitic capacitance. With only one fitting parameter, the model demonstrates high accuracy across different device structures. A comparative analysis with lateral nanosheet field-effect transistor (NsFET) devices highlights the impact of the stacked nFET-on-pFET architecture on parasitic capacitance overheads.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 9","pages":"4621-4628"},"PeriodicalIF":3.2000,"publicationDate":"2025-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comprehensive Study of Parasitic Capacitance in CFETs: An Analytical Perspective\",\"authors\":\"Aishwarya Singh;Jaisingh Pal;Om Maheshwari;Nihar R. Mohapatra\",\"doi\":\"10.1109/TED.2025.3585907\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents a comprehensive study on parasitic capacitance and its corresponding analytical model for complementary field-effect transistor (CFET) devices. The model accounts for various capacitance components, including parallel plate, perpendicular and coplanar plate fringing, junction, separator, and offset capacitances between the gate and source/drain. Individual parasitic capacitance components are isolated using TCAD simulations by adjusting the geometrical and material properties of the device. The fringing capacitance components are modeled using the elliptical integral method, and the model effectively captures the significant contribution of separator capacitance (~20%) to the total parasitic capacitance. With only one fitting parameter, the model demonstrates high accuracy across different device structures. A comparative analysis with lateral nanosheet field-effect transistor (NsFET) devices highlights the impact of the stacked nFET-on-pFET architecture on parasitic capacitance overheads.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"72 9\",\"pages\":\"4621-4628\"},\"PeriodicalIF\":3.2000,\"publicationDate\":\"2025-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11084946/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11084946/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文对互补场效应晶体管(CFET)器件的寄生电容及其相应的分析模型进行了全面的研究。该模型考虑了各种电容组件,包括平行板、垂直板和共面板边、结、分离器以及栅极和源/漏极之间的偏置电容。通过调整器件的几何和材料特性,利用TCAD模拟对各个寄生电容元件进行隔离。采用椭圆积分法对边缘电容分量进行了建模,该模型有效地捕捉到了隔板电容对总寄生电容的显著贡献(~20%)。该模型仅使用一个拟合参数,在不同的器件结构下均具有较高的拟合精度。与横向纳米片场效应晶体管(NsFET)器件的比较分析强调了堆叠的nfet -on- fet架构对寄生电容开销的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comprehensive Study of Parasitic Capacitance in CFETs: An Analytical Perspective
This work presents a comprehensive study on parasitic capacitance and its corresponding analytical model for complementary field-effect transistor (CFET) devices. The model accounts for various capacitance components, including parallel plate, perpendicular and coplanar plate fringing, junction, separator, and offset capacitances between the gate and source/drain. Individual parasitic capacitance components are isolated using TCAD simulations by adjusting the geometrical and material properties of the device. The fringing capacitance components are modeled using the elliptical integral method, and the model effectively captures the significant contribution of separator capacitance (~20%) to the total parasitic capacitance. With only one fitting parameter, the model demonstrates high accuracy across different device structures. A comparative analysis with lateral nanosheet field-effect transistor (NsFET) devices highlights the impact of the stacked nFET-on-pFET architecture on parasitic capacitance overheads.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信