一种用于ESD保护的高保持电压和耐高温嵌入式双极晶体管的新型可控硅拓扑结构

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yujie Liu;Yang Wang;Ke Zhang;Jian Yang;Xiangliang Jin
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引用次数: 0

摘要

汽车电子设备通常在具有明显静电干扰的高温环境中运行,这增加了对片上静电放电(ESD)保护的可靠性要求。为了更好地解决这些具有挑战性的条件,本文提出了一种用于ESD保护的嵌入式双极晶体管(SCRTEBT)的新型硅控整流器拓扑。通过结合双极晶体管电流路径和调制寄生n-p-n晶体管的电流增益,显著提高了SCRTEBT器件的ESD性能。测试结果表明,SCRTEBT具有10.83 V的高保持电压,同时还提供窄的ESD窗口(~2.37 V),并且具有优异的高温耐受性。该设备概念可用于实现受电气超应力条件影响的系统,并要求在汽车等恶劣环境中运行。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel SCR Topology of Embedded Bipolar Transistor With High-Holding Voltage and High-Temperature Tolerance for ESD Protection
Automotive electronics typically operate in high-temperature environments with significant electrostatic interference, which increases the reliability requirements for on-chip electrostatic discharge (ESD) protection. To better address these challenging conditions, this article presents a novel silicon-controlled rectifier topology of embedded bipolar transistor (SCRTEBT) for ESD protection. The ESD performance of the SCRTEBT device is significantly enhanced by combining bipolar-transistor current paths and modulating the current gain of parasitic n-p-n transistors. Test results indicate that the SCRTEBT has a high-holding voltage of 10.83 V, while also providing a narrow ESD window (~2.37 V), and excellent high-temperature tolerance. The device concept can have applications for implementing systems subject to electrical overstress conditions and required to operate in harsh environments such as automotive.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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