液体膏状互连在硅功率二极管上

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-10 DOI:10.1109/TCPMT.2025.3582563

Nick Baker;Francesco Iannuzzo;Szymon Bęczkowski

{"title":"液体膏状互连在硅功率二极管上","authors":"Nick Baker;Francesco Iannuzzo;Szymon Bęczkowski","doi":"10.1109/TCPMT.2025.3582563","DOIUrl":null,"url":null,"abstract":"State-of-the-art power semiconductors use solid metal interconnects such as wire-bonding, soldering, and sintering. Thermo-mechanical stress degrades these solid metal interconnects and is the main cause of failure in power semiconductors. This letter demonstrates the use of liquid-metals (LMs), which are inherently resistant to thermo-mechanical stress, to package a silicon power diode. The manufacturing process is performed below <inline-formula> <tex-math>$80~^{\\circ }$ </tex-math></inline-formula>C. The thermo-mechanical lifetime is assessed through power cycling and is shown to increase by factor of 3.3x in comparison to SAC305 solder and aluminum wirebonded diodes. In addition, the thermal resistance of LM packaged diodes shows a 9% improvement. Corrosion and pump out of the LM is thought to be the failure mode.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1661-1665"},"PeriodicalIF":3.0000,"publicationDate":"2025-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Liquid Paste Interconnects on a Silicon Power Diode\",\"authors\":\"Nick Baker;Francesco Iannuzzo;Szymon Bęczkowski\",\"doi\":\"10.1109/TCPMT.2025.3582563\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"State-of-the-art power semiconductors use solid metal interconnects such as wire-bonding, soldering, and sintering. Thermo-mechanical stress degrades these solid metal interconnects and is the main cause of failure in power semiconductors. This letter demonstrates the use of liquid-metals (LMs), which are inherently resistant to thermo-mechanical stress, to package a silicon power diode. The manufacturing process is performed below <inline-formula> <tex-math>$80~^{\\\\circ }$ </tex-math></inline-formula>C. The thermo-mechanical lifetime is assessed through power cycling and is shown to increase by factor of 3.3x in comparison to SAC305 solder and aluminum wirebonded diodes. In addition, the thermal resistance of LM packaged diodes shows a 9% improvement. Corrosion and pump out of the LM is thought to be the failure mode.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 8\",\"pages\":\"1661-1665\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2025-07-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11077423/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11077423/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

最先进的功率半导体使用固体金属互连，如线键合，焊接和烧结。热机械应力降低了这些固体金属互连，是功率半导体故障的主要原因。这封信展示了使用液态金属（LMs）来封装硅功率二极管，液态金属本身就能抵抗热机械应力。制造过程在$80~^{\circ}$ c以下进行，通过功率循环评估热机械寿命，与SAC305焊料和铝线结二极管相比，增加了3.3倍。此外，LM封装二极管的热阻提高了9%。腐蚀和泵出LM被认为是失效模式。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Liquid Paste Interconnects on a Silicon Power Diode

State-of-the-art power semiconductors use solid metal interconnects such as wire-bonding, soldering, and sintering. Thermo-mechanical stress degrades these solid metal interconnects and is the main cause of failure in power semiconductors. This letter demonstrates the use of liquid-metals (LMs), which are inherently resistant to thermo-mechanical stress, to package a silicon power diode. The manufacturing process is performed below

$80~^{\circ }$

C. The thermo-mechanical lifetime is assessed through power cycling and is shown to increase by factor of 3.3x in comparison to SAC305 solder and aluminum wirebonded diodes. In addition, the thermal resistance of LM packaged diodes shows a 9% improvement. Corrosion and pump out of the LM is thought to be the failure mode.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.