基于喷注的电力电子模块电场自适应控制结构装配

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-06-10 DOI:10.1109/TCPMT.2025.3578405

Ya Sun;Zhikang Yuan;Zhiwen Huang;Jun Hu;Jinliang He

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引用次数: 0

摘要

在功率模块中，“铜-陶瓷-硅凝胶”三相点的局部放电（PD）对高电压和高功率密度的发展提出了重大挑战。本文采用可靠可控的喷射点胶方法，在电力电子模块中装配电场自适应控制结构，以优化电场分布。该结构由ZnO/环氧树脂非线性电导率复合材料组成，厚度控制在$300~\pm ~ $ 50~\mu $ m。组装后的电场自适应控制结构显著提高了模块的PD起始电压（PDIV），在正弦波下从6.0提高到13.2 kV，提高了120.0%，在正极性方波脉冲下从4.0提高到9.6 kV，提高了140.0%。本文为非线性材料在电力电子模块中的应用提供了一个新的视角。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules

In power modules, partial discharge (PD) at the triple points of “Copper-Ceramic-Silicone Gel” poses a significant challenge to the development of higher voltage and power density. This article utilized a reliable and controllable method, jet dispensing, to assemble the electric field adaptively controlled structure in power electronic modules to optimize the electric field distribution. The structure was composed of ZnO/epoxy resin nonlinear conductivity composites, with the thickness controlled at

$300~\pm ~50~\mu $

m. The assembled electric field adaptively controlled structure significantly enhanced the PD inception voltage (PDIV) of the module from 6.0 to 13.2 kV, with a 120.0% increase under the sinusoidal waves, and from 4.0 to 9.6 kV under positive polarity square-wave pulses, with an increased ratio of 140.0%. This article provides a new perspective on the application of nonlinear materials in power electronic modules.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.