利用转镜透镜阵列实现光子集成电路的面外光耦合

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-19 DOI:10.1109/TCPMT.2025.3552840

Kamil Gradkowski;Peter O'Brien

{"title":"利用转镜透镜阵列实现光子集成电路的面外光耦合","authors":"Kamil Gradkowski;Peter O'Brien","doi":"10.1109/TCPMT.2025.3552840","DOIUrl":null,"url":null,"abstract":"We demonstrate an out-of-plane optical coupling between a photonic integrated circuit (PIC) and a fiber array (FA). The presented scheme utilizes a molded glass microlens with an integrated turning mirror. We show that by expanding the beam, the alignment tolerances between the fiber and PIC assemblies are expanded by an order of magnitude. The reported coupling losses of 2.1 dB per coupler are only limited by the optical design of the off-the-shelf micro-optics.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 8","pages":"1601-1605"},"PeriodicalIF":3.0000,"publicationDate":"2025-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10933919","citationCount":"0","resultStr":"{\"title\":\"Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays\",\"authors\":\"Kamil Gradkowski;Peter O'Brien\",\"doi\":\"10.1109/TCPMT.2025.3552840\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate an out-of-plane optical coupling between a photonic integrated circuit (PIC) and a fiber array (FA). The presented scheme utilizes a molded glass microlens with an integrated turning mirror. We show that by expanding the beam, the alignment tolerances between the fiber and PIC assemblies are expanded by an order of magnitude. The reported coupling losses of 2.1 dB per coupler are only limited by the optical design of the off-the-shelf micro-optics.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 8\",\"pages\":\"1601-1605\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2025-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10933919\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10933919/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10933919/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

我们展示了光子集成电路（PIC）和光纤阵列（FA）之间的面外光耦合。所提出的方案利用一个模压玻璃微透镜与一个集成的旋转镜。我们表明，通过扩大光束，光纤和PIC组件之间的对准公差扩大了一个数量级。据报道，每个耦合器2.1 dB的耦合损耗仅受现成微光学光学设计的限制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays

We demonstrate an out-of-plane optical coupling between a photonic integrated circuit (PIC) and a fiber array (FA). The presented scheme utilizes a molded glass microlens with an integrated turning mirror. We show that by expanding the beam, the alignment tolerances between the fiber and PIC assemblies are expanded by an order of magnitude. The reported coupling losses of 2.1 dB per coupler are only limited by the optical design of the off-the-shelf micro-optics.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.