小型化超表面可调谐功率分压器和移相器

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-10 DOI:10.1109/TCPMT.2025.3588044

Nophadon Wiwatcharagoses;Sambit Kumar Ghosh;Premjeet Chahal

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引用次数: 0

摘要

采用超表面（MS）单元电池的复合左/右传输线（CRLH TL）概念被重新提出，以提出平面可调谐和小型化的功率分配器和移相器器件。制造处理单层金属图案和变容二极管。电子行为可以通过改变直流偏置电压来改变。提出了一种具有等分功率和不等分功率的平面x波段功率分配器。实验结果表明，该系统具有140 mhz的中心频率调谐能力。它在两个输出端口之间实现了4.5 dB的最高功率传输差异，而性能没有任何显着变化。另一种谐振频率为8.95 GHz和10.25 GHz的设计与变容二极管一起提出，以产生可调谐的相移特性。它在几乎2 ghz的带宽上产生45°的宽线性相位调谐范围。这两种原型都可以轻松集成有源设备，以获得可调功能。

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Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter

Composite right/left-handed transmission line (CRLH TL) concept with metasurface (MS) unit cells is resurfaced to propose planar tunable and miniaturized power divider and phase shifter devices. Fabrication deals with monolayer metal patterning and varactor diodes. Electronic behavior can be modified by varying the dc bias voltages. A planar X-band power splitter with both equal and unequal power dividing properties is presented. Experimental outcomes confirm that it has 140-MHz center frequency tuning capability. It achieved a highest difference in power transfer of 4.5 dB between the two output ports without any notable change in the performance. Another design having resonant frequencies of 8.95 and 10.25 GHz along with varactor diodes is proposed to produce tunable phase shift characteristics. It generates a wide linear phase tuning range of 45° over almost a 2-GHz bandwidth. Both the prototypes allow an easy integration of active devices to attain tunable functionalities.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.