集成电化学技术用于半导体废水中金属的高效回收

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-01-08 DOI:10.1109/TSM.2025.3527310

Cameron A. Lippert;James R. Landon;Jason Keleher;Alan Rassoolkhani

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引用次数: 0

摘要

在本文中，我们研究了高效选择性电化学电池（HESEC）从各种半导体废水流中回收铜的潜力，同时也达到了EPA排放标准。铜化学机械刨平（CuCMP）、湿法蚀刻和电镀工艺会产生大量含铜废水，这些废水具有复杂的基质，使铜的回收变得困难。基于我们的实验结果，HESEC提供了新的电化学电池设计如何用于从不同的废水流中实现选择性铜去除和回收，并为经济的点源处理和可持续实践的实施开辟了新的可能性。

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Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater

In this paper, we investigate the potential of a High Efficiency Selective Electrochemical Cell (HESEC) to recover copper from a variety of semiconductor wastewater streams while also achieving EPA discharge compliance. The copper chemical-mechanical planarization (CuCMP), wet etch, and electroplating processes produce significant levels of copper laden wastewaters with complex matrices that make recovery of the copper difficult. Based on our experimental results, the HESEC provides insight into how novel electrochemical cell designs can be used to achieve selective copper removal and recovery from different wastewater streams and open new possibilities for economical point source treatment and implementation of sustainable practices.

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.