Yongjiang Lei , Wenbiao Zhang , Menglin Liu , Lei Chi
{"title":"基于声发射信号时频分析的SiC mosfet故障诊断","authors":"Yongjiang Lei , Wenbiao Zhang , Menglin Liu , Lei Chi","doi":"10.1016/j.microrel.2025.115897","DOIUrl":null,"url":null,"abstract":"<div><div>In the high-frequency switching applications of SiC MOSFETs, traditional techniques are faced with challenges in achieving non-invasiveness measurement, real-time evaluation, and online monitoring. An effective condition monitoring approach for SiC MOSFETs is crucial to ensure the safe operation of power electronic systems. A solution based on the acoustic emission (AE) detection technique is proposed in this paper. Through the utilization of time-frequency analysis, the time-frequency characteristics of the AE signals generated by SiC MOSFETs under double-pulse test conditions have been explored. Three multi-dimensional characteristic parameters, namely time-frequency variance, energy entropy, and time-frequency center of gravity, have been used, which can achieve quantitative characterization of the dynamic behavior from SiC MOSFETs. By systematically comparing the time-frequency characteristics of AE signals from SiC MOSFETs under normal operating conditions and typical faulty states, the experimental results indicate that the combination of the three characteristics can be employed to identify different types of faults.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"174 ","pages":"Article 115897"},"PeriodicalIF":1.9000,"publicationDate":"2025-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fault diagnosis of SiC MOSFETs based on time-frequency analysis of acoustic emission signals\",\"authors\":\"Yongjiang Lei , Wenbiao Zhang , Menglin Liu , Lei Chi\",\"doi\":\"10.1016/j.microrel.2025.115897\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In the high-frequency switching applications of SiC MOSFETs, traditional techniques are faced with challenges in achieving non-invasiveness measurement, real-time evaluation, and online monitoring. An effective condition monitoring approach for SiC MOSFETs is crucial to ensure the safe operation of power electronic systems. A solution based on the acoustic emission (AE) detection technique is proposed in this paper. Through the utilization of time-frequency analysis, the time-frequency characteristics of the AE signals generated by SiC MOSFETs under double-pulse test conditions have been explored. Three multi-dimensional characteristic parameters, namely time-frequency variance, energy entropy, and time-frequency center of gravity, have been used, which can achieve quantitative characterization of the dynamic behavior from SiC MOSFETs. By systematically comparing the time-frequency characteristics of AE signals from SiC MOSFETs under normal operating conditions and typical faulty states, the experimental results indicate that the combination of the three characteristics can be employed to identify different types of faults.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"174 \",\"pages\":\"Article 115897\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2025-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271425003105\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425003105","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Fault diagnosis of SiC MOSFETs based on time-frequency analysis of acoustic emission signals
In the high-frequency switching applications of SiC MOSFETs, traditional techniques are faced with challenges in achieving non-invasiveness measurement, real-time evaluation, and online monitoring. An effective condition monitoring approach for SiC MOSFETs is crucial to ensure the safe operation of power electronic systems. A solution based on the acoustic emission (AE) detection technique is proposed in this paper. Through the utilization of time-frequency analysis, the time-frequency characteristics of the AE signals generated by SiC MOSFETs under double-pulse test conditions have been explored. Three multi-dimensional characteristic parameters, namely time-frequency variance, energy entropy, and time-frequency center of gravity, have been used, which can achieve quantitative characterization of the dynamic behavior from SiC MOSFETs. By systematically comparing the time-frequency characteristics of AE signals from SiC MOSFETs under normal operating conditions and typical faulty states, the experimental results indicate that the combination of the three characteristics can be employed to identify different types of faults.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.