基于模糊算法的数字电路可靠性评估模型(FARAM-DC)

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Somayeh Bahramnejad
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引用次数: 0

摘要

可靠性在数字电路和基于sram的fpga(用于电路实现的可编程器件)中至关重要。因此,本文提出了一种基于sram的fpga中数字电路失效概率和可靠性的评估方法。对FPGA电路的可靠性有各种各样的研究;它们大多考虑宇宙辐射对电路可靠性的影响,从而导致单事件扰流(SEUs)。很少考虑硬件和软件故障的影响。本研究提出的方法考虑了不同因素对电路故障的影响,包括灰尘、潮湿、温度和抖动引起的硬件故障,编程错误引起的软件故障,以及辐射引起的seu。由于难以精确估计各种因素对电路失效的影响,因此采用定性值来解释这些影响,并采用模糊算法估计故障概率和可靠性。结果给出了对数字电路可靠性的精确评估,但忽略了每个有效因素,导致可靠性的高估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A fuzzy-arithmetic-based reliability assessment model for digital circuits (FARAM-DC)

A fuzzy-arithmetic-based reliability assessment model for digital circuits (FARAM-DC)
Reliability is crucial in digital circuits and SRAM-based FPGAs, the programmable devices used for circuit implementation. Hence, this article proposes an assessment method for failure probability and reliability of digital circuits in SRAM-based FPGAs. There are various studies on the reliability of FPGA circuits; most of them consider the effect of cosmic radiation on the circuit's reliability, which results in Single-Event Upsets (SEUs). The impact of hardware and software failures is rarely considered. The proposed method in this research considers the effects of different factors on the circuit's failure, including hardware failures resulting from dust, wetness, temperature, and jitter, software failures resulting from programming errors, and SEUs resulting from radiation. Since precise estimation of the factors’ effects on the circuit's failure is difficult, qualitative values are used to explain the impacts and estimate the failure probability and reliability using Fuzzy arithmetic. The results present a precise evaluation of the reliability of digital circuits, which, ignoring each effective factor, leads to an overestimation of reliability.
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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