Ag含量对NbN-Ag薄膜微观结构、力学性能和摩擦学性能的影响

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS
Haoming Du, Changpeng Zhang, Rulin Zhang, Chengqi Zhu
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引用次数: 0

摘要

金属相Ag由于具有较低的临界剪切应力,在过渡金属氮化硬膜的减磨增韧研究中得到了广泛的应用。本研究通过反应磁控溅射沉积不同银含量的NbN-Ag纳米结构薄膜,探索其微观结构、力学性能和摩擦学行为之间的内在关系。Ag掺杂水平为~ 2.1 At。%,发现fcc-Ag相与fcc-NbN基体相共存,其中Ag以二维覆盖层或纳米晶粒的形式嵌入。随着Ag含量的增加,膜的硬度先升高后降低,在~ 2.1 at时,膜的硬度在~ 17.6 GPa处达到峰值。% ag掺杂薄膜。这种强化主要是由于第二相Ag引起的晶界强化。平均摩擦系数随Ag含量的增加呈减小趋势。膜带~ 2.1 at。% Ag表现出最好的耐磨性,平均摩擦系数为~ 0.54。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Ag content on the microstructure, mechanical and tribological properties of NbN-Ag films
The metal phase Ag, due to its low critical shear stress, has been widely applied in the research of wear reduction and toughening of transition metal nitride hard films. In this study, NbN-Ag nanostructured films with various Ag content were deposited via reactive magnetron sputtering to explore the intrinsic relationship between their microstructure, mechanical properties, and tribological behavior. At an Ag doping level of ∼ 2.1 at. %, the fcc-Ag phase was found to coexist with the fcc-NbN matrix phase, where Ag was embedded either as a two-dimensional overlayer or as nanocrystalline grains. The film hardness initially increased and then decreased with rising Ag content, peaking at ∼17.6 GPa for the ∼2.1 at. % Ag-doped film. This enhancement was primarily attributed to grain boundary strengthening induced by the second-phase Ag. Moreover, the average friction coefficient exhibited a decreasing trend with increasing Ag content. The film with ∼2.1 at. % Ag demonstrated the best wear resistance, exhibiting an average friction coefficient of ∼ 0.54.
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来源期刊
Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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