Guoliao Sun , Wenhui Zhu , Liangcheng Wang , Hongwei Liu , Xianchi Wang
{"title":"功率循环下功率模块疲劳寿命的体积加权平均预测","authors":"Guoliao Sun , Wenhui Zhu , Liangcheng Wang , Hongwei Liu , Xianchi Wang","doi":"10.1016/j.microrel.2025.115866","DOIUrl":null,"url":null,"abstract":"<div><div>With the continuous increase in power density of electric vehicle (EV) power modules, double-sided cooling (DSC) technology has become a focal point of research. However, the commercialization of DSC power modules is significantly hindered by their complex manufacturing processes and high development costs. Traditional power cycling reliability assessment methods, which are costly and time-consuming, are not conducive to rapid technological iteration and advancement. This study proposes a lifetime prediction model based on volume-weighted average strain energy density, utilizing a global volume-weighted averaging technique rather than focusing on the maximum stress and strain locations at solder joints. Through least-squares curve fitting analysis, numerous volume-weighted average strain energy density simulation results were correlated with corresponding power cycling test results, allowing the determination of material-specific fatigue coefficients in the lifetime prediction model. The feasibility of the proposed model was validated using commercially available insulated-gate bipolar transistor (IGBT) power modules. Furthermore, the influence of different buffer materials on the lifetime of DSC IGBT power modules was thoroughly evaluated. This study provides valuable insights for accelerating the development of DSC power modules in the future.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"174 ","pages":"Article 115866"},"PeriodicalIF":1.9000,"publicationDate":"2025-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fatigue lifetime prediction of power modules under power cycling using a volume-weighted averaging technique\",\"authors\":\"Guoliao Sun , Wenhui Zhu , Liangcheng Wang , Hongwei Liu , Xianchi Wang\",\"doi\":\"10.1016/j.microrel.2025.115866\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>With the continuous increase in power density of electric vehicle (EV) power modules, double-sided cooling (DSC) technology has become a focal point of research. However, the commercialization of DSC power modules is significantly hindered by their complex manufacturing processes and high development costs. Traditional power cycling reliability assessment methods, which are costly and time-consuming, are not conducive to rapid technological iteration and advancement. This study proposes a lifetime prediction model based on volume-weighted average strain energy density, utilizing a global volume-weighted averaging technique rather than focusing on the maximum stress and strain locations at solder joints. Through least-squares curve fitting analysis, numerous volume-weighted average strain energy density simulation results were correlated with corresponding power cycling test results, allowing the determination of material-specific fatigue coefficients in the lifetime prediction model. The feasibility of the proposed model was validated using commercially available insulated-gate bipolar transistor (IGBT) power modules. Furthermore, the influence of different buffer materials on the lifetime of DSC IGBT power modules was thoroughly evaluated. This study provides valuable insights for accelerating the development of DSC power modules in the future.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"174 \",\"pages\":\"Article 115866\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2025-07-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271425002793\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425002793","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Fatigue lifetime prediction of power modules under power cycling using a volume-weighted averaging technique
With the continuous increase in power density of electric vehicle (EV) power modules, double-sided cooling (DSC) technology has become a focal point of research. However, the commercialization of DSC power modules is significantly hindered by their complex manufacturing processes and high development costs. Traditional power cycling reliability assessment methods, which are costly and time-consuming, are not conducive to rapid technological iteration and advancement. This study proposes a lifetime prediction model based on volume-weighted average strain energy density, utilizing a global volume-weighted averaging technique rather than focusing on the maximum stress and strain locations at solder joints. Through least-squares curve fitting analysis, numerous volume-weighted average strain energy density simulation results were correlated with corresponding power cycling test results, allowing the determination of material-specific fatigue coefficients in the lifetime prediction model. The feasibility of the proposed model was validated using commercially available insulated-gate bipolar transistor (IGBT) power modules. Furthermore, the influence of different buffer materials on the lifetime of DSC IGBT power modules was thoroughly evaluated. This study provides valuable insights for accelerating the development of DSC power modules in the future.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.